MZ TECHNOLOGIES, rebrand of Monozukuri EDA, unveiled GENIO™, the first commercially available IC/Package Co-Design Tool.

GENIO™ Available Immediately.

Monozukuri Unveils First Commercially-Available IC / Package Co-Design Tool

GENIOTM Available Immediately


Rome – Italy – August 25, 2020

Monozukuri S.p.A, today unveiled GENIOTM, the first commercially available IC/Package Co-Design Tool.  The company said that is able to take orders for GENIOTM now.GENIOTM is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.

GENIOTM integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.  It is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization.

“GENIOTM is not a promise or partial solution.  It is a breakthrough, ground-up tool that is ready for implementation today,” said Anna Fontanelli, Founder and CEO.

“GENIOTM’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization”, she explained.

Equally important is the fact that GENIO is agnostic to all EDA flows.  It is not a ‘bolt on’ capability like other co-design options, but a total re-conceptualizion and implementation that maximizes design efficiency across system level design.

GENIOTM ’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

The DuetTM graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. The system’s efficient automation allows designers to create, explore, optimize and compare different floor-planning, scenarios and dynamically modify and store optimization results according to the final configuration.

As an integrated IC and packaging co-design EDA tool, GENIOTM sets a new benchmark for creating heterogeneous microelectronic systems-level design for advanced applications such as artificial intelligence, virtual reality and web scale infrastructure.

For a more information, go to

About Monozukuri

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground breaking EDA software solutions and methodologies.
The GENIOTM technology was developed under the H2020 HIPER project. HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
+1 408 310 9244

Business contact                                              
Eric Gunn
+44 0783 4490803

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