EE Times Europe mentions the GENIO™ EDA design tool as the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems.
EDA TOOL FOR HETEROGENEOUS SYSTEMS
On the tools and software front, a new EDA design tool is claimed to be the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems. The GENIO tool, from Rome-based startup Monozukuri Technologies, integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multichip designs that comprise advanced heterogeneous microelectronic systems. GENIO is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization, according to the company.
The cross-hierarchical, 3D-aware design methodologies streamline the IC ecosystem, integrating IC and advanced packaging design to ensure full system-level optimization, shortening the design cycles, accelerating time to manufacturing, and improving yields. The industry is moving to heterogeneous integration to overcome the limitations of Moore’s Law in enhancing performance. But the diverse nature of silicon and package technologies and the use of highspeed interconnections call for enhancements in co-design capabilities to enable planning, implementation, and analysis across different engineering domains as well as to provide a complete, consistent model across tool platforms.
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