
The first commercially-available integrated IC/Packaging co-design EDA tool
The Foundation for Chiplet Design
Provides dynamic System views
Revolutionary fully Integrated end-to-end IC and Packaging Co-design
Enables design of 2D/2.5D/3D-IC systems
“What-if” system-level architectural exploration
Create Full 2D/2.5D/3D 2.5D Co-design and I/O Optimization
Interfaces to existing EDA environments and custom design flows
Shortens Design Cycles, Drives Faster Time-to-Manufacturing, Improve Yields
Functions across system design at macro and micro levels
3D-aware Cross-hierarchical pathfinding
Silicon Interposer, floor-planning aware, design and optimization
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