THE PROBLEM

Today, more and more semiconductor applications are driving highly complex solutions that require integrating multiple functionalities, high-speed processing and an enormous amount of data storage.

As a result, single-chip integration has become technically challenging and economically impractical. Why?

  • Big data is exploding, requiring more computing resources and I/O components
  • Transistor sizes are fast reaching their physical reduction limits that caps the single-chip achievement of “Moore law”
  • IC complexity is expanding exponentially and with it, skyrocketing IC design costs

What’s required is a new level of physical integration that continues meeting the promise of cope Moore’s law.  In other words, new innovative ways to put multiple chips together in an ever-shrinking foot print.

Heterogeneous integration is the semiconductor industry’s answer.  But that solution brings with it a whole new set of design challenges.

  • Overcoming diverse silicon and package technologies
  • Accommodating high-speed interconnection demands for IC/packaging co-design capabilities
  • Implementation and analysis across different engineering domains
  • Complete, consistent model across tool platforms.

What’s needed is revolutionary EDA solution.  A single, integrated tool that supports all current and future IC and package EDA design platforms. In other words, the missing piece of the EDA puzzle; an EDA tool that completes next generation system designs, gives a differentiating edge to existing solutions and provides faster, lower cost and system optimization.

How to leverage 2.5D features? Creating a new abstraction level, in which the system is split into multiple die (stacked or placed side by side), laid onto a Silicon Interposer or onto a Package or a combination of these.

For instance, a Silicon Interposer can host a large number of die-to-die connection, allowing an increase of I/O ports density. 2.5D-IC can thus provide enhanced system performance, reduce power consumption and support heterogeneous die integration.

THE SOLUTION

Meet he GENIOTM product family, the first truly integrated from the ground up EDA IC/packaging co-design tools. GENIO™ provides a holistic design environment that ensures design efficiency.  In other words, fast time-to-design, fast-time-to production, fast time-to-market and faster time-to-success.

GENIO’s holistic design environment overcomes the twin challenges of integrating diverse silicon and package technologies and coupling them with high-speed interconnections in an elegant, efficient design.

It drives the design from concept to design First Time Right silicon success through system level exploration across architectures.

GENIOTM provides chiplets/die, silicon interposer, package, and surrounding PCB co-design features that achieve area, power, and performance targets. It’s technology agnostic and seamlessly integrates through standard formats with all the existing commercial implementation platforms or to custom EDA flows through dedicated plug-ins.

GENIO’s co-design features include:

  • An integrated environment across all platforms used for implementation and analysis of digital die, analog die, package, and PCB design
  • A single, consistent interconnect manager that represents and maintains the interconnect model of the entire system that – replaces the error-prone spreadsheet exchange between engineering team
  • A unique Cross-Hierarchical 3D-aware pathfinding engine that identifies the best interconnect in a 3D space. It optimizes hundreds of thousands of connections while reducing the number of physical resources needed for implementation.

Check out the entire GENIO Family on the following pages.

Cross-Hierarchical Optimization (CHO)

GENIO 3D-aware pathfinding engine enables interconnect optimization across a complete 3D system architecture. Groups of signals can be cross-highlighted in the Connectivity, Nets and Pins panels, while displayed in the 2D and 3D canvas.

Cross-Hierarchical Optimization
GENIO Cross-Hierarchical Optimization
Design Constraints

GENIO “What & Where” metodology facilitate driving the system interconnect optmization. Pin Groups can be created across the system stack to drive the optimization in selected areas. Signal Groups are automatically genereted by the CHO, after optimization, to collect signals assigned to Pin Groups.

Physical and electrical design constraints
GENIO physical and electrical design constraints

Learn more on GENIOTM  latest version

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