GENIO 3D automates I/O management, planning, and optimization in a stack of ICs down to package level. Using the tool designers can quickly and easily assemble complete cross-domain systems (ICs and package) and drive pin assignment and optimization through a rule-based methodology.
The environment enables the integration of multiple high-pin count chips into a wide variety of package configuration, and supports wire-bond, flip-chip or mixed assembly methods.
A drag-and-drop technique can be used to compose the system hierarchy directly in the graphic system view.
With a common methodology, system architect can control the design from an IC-centric or package-centric perspective during early planning and prototyping or detailed implementation.

Key Features
  • GENIO 3D supports both traditional 3D systems (wire-bonding, mixed wire-bonding and flip-chip) as well as advanced 3D systems (pure flip-chip using TSV for vertical interconnect).
  • Multi level stacks are supported with a single component for hierarchical level
  • GENIO 3D includes “SMART” TSV placement and assignment. By optimising the TSV matrix and reducing the TSV resources needed the system design can be optimised in order to minimise manufacturing cost and maximise production yields.
  • GENIO 3D facilitates early on “what- if” analysis of stacking options thus enabling a complete optimisation.
  • GENIO 3D enables end to end full pathfinding across all assembly styles.
  • GENIO 3D facilitates the seamless flow of data between different domains allowing changes to automatically propagate to adjacent components where their impact can be immediately evaluated. Feasibility functions provide the means to incorporate aspects of detailed implementation while still in the early stages of design planning. This ability to optimize the IO and connectivity design plan prior to detailed implementation will result in optimal performance, cost and manufacturability.
  • GENIO 3D Provides a 3D interactive preview of the complete assembled system.
  • GENIO 3D coexists with the existing IC and package EDA design platform.
TSV management and optimization

Through Silicon Vias (TSV) can be placed in IC components to become part of the vertical system interconnect. GENIO 3D minimize the overall number of TSV needed and optimize the system interconnect: unused TSVs are discarted while the used ones are back annotated for physical implementation.

2.5D system architecture - TSV planning
End to end interconnect planning
Stack Planning optimization

Helps to identify the best stack configuration among the (# of components)! possible ones by enabling vertical shufflling of multiple ICs across the 3D Stack.

3D stack floor planning
Options

GENIO 3D product may include 2 optional features: I/O Ring Builder and RDL feasibility router.

Option 1  –  I/O Ring Builder

I/O rings can be automatically generated using a pattern-based methodology.

FANOUT PACKAGING
2D system architecture
Option 2  –  RDL feasibility router

One-layer feasibility router facilitate in-chip exploration of many different bumping configurations.

Design Methodologies
  • Designers may interactively or semi-automatically build a partial or full I/O Plan of each IC component: number of I/Os on each IC side, number of Powers & Grounds required and their placement, placement of busses, placement of differential pairs, addition of special cells. Memory and IP can also be imported as read-only silicon components to be used as constraints during System optimization.
  • GENIO 3D enables the creation of new packages or the re-use of existing ones. An existing initial ball-out assignment can be taken into consideration or a new one generated automatically.
  • Multiple components from the different domains can be placed and connected to create the final System layout starting from either open data or spreadsheet. Different stacking configurations can be explored, the pin-out optimization being based on the system floorplan, connectivity, and electrical constraints. Finally, the optimized I/O assignment of each single component can be back annotated to Place&Route tools and  Package design technology of choice.
  • A Rules Engine supports standard rules but also enables the user to customize assignment rules for both I/O Placement and Package ball-out during automatic creation and optimization.
  • System design data is entered in arbitrary order, as it becomes available during the design flow. GENIO 3D therefore provides value early during feasibility studies or early design planning and continues to add value throughout the full system design process, as the design becomes more refined.