GENIO IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization

AiThority mentions GENIO™ as the first EDA design tool to offer end-to-end optimitazion.

GENIO IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization

 

MZ Technologies underscored several key IC/package co-design features that are critical to meeting today’s high-performance advanced technology IC device needs. The company’s GENIO IC/Package Co-Design EDA tool is the industry’s only end-toend optimized solution that covers all the requirements.

Visionary IC systems designers have identied seven key features that should be incorporated into the ideal integrated IC/package co-design tool. These include: IC, package PCB design environment support, system-level I/O planning and optimization, a holistic design environment, mixed silicon and photonics, interconnect optimization, open standards, and tool agnostic work fows.

GENIO is the only EDA tool that provides all seven, integrating silicon and package EDA flows to create a full co-design and end-to-end optimized design environment for complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.

“The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution.  Because we imagined and built the technology platform from the ground up, GENIO is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.

“The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution. Because we imagined and built the technology platform from the ground up, GENIO is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.

GENIO’s holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system.  It has proven to be very application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept-to-design methodology, thanks to strong “what-if” analysis and system level exploration across architectures.  GENIO identifies the most proficient solution and avoids entering “dead-end” architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.

GENIO also eliminates design environment boundaries to enable system architectural exploration that identifies errors and bottleneck early in the design process. It also features cross-hierarchical pathfinding for pin assignment optimization, wire lengths/crossovers reduction, and floor planning-aware silicon interposer design.


For further information, please link to the full Article



EDA TOOL FOR HETEROGENEOUS SYSTEMS

EE Times Europe mentions the GENIO™ EDA design tool as the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems.

EDA TOOL FOR HETEROGENEOUS SYSTEMS

On the tools and software front, a new EDA design tool is claimed to be the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems. The GENIO tool, from Rome-based startup Monozukuri Technologies, integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multichip designs that comprise advanced heterogeneous microelectronic systems. GENIO is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization, according to the company.

The cross-hierarchical, 3D-aware design methodologies streamline the IC ecosystem, integrating IC and advanced packaging design to ensure full system-level optimization, shortening the design cycles, accelerating time to manufacturing, and improving yields. The industry is moving to heterogeneous integration to overcome the limitations of Moore’s Law in enhancing performance. But the diverse nature of silicon and package technologies and the use of highspeed interconnections call for enhancements in co-design capabilities to enable planning, implementation, and analysis across different engineering domains as well as to provide a complete, consistent model across tool platforms.


For further information, please link to the complete Article



End-to-End Optimization

Pop Quiz: Can you name the only True End-to-End Optimized IC/Package Co-Development Tool?

The correct answer is:  GENIOTM from MZ Technologies.

GENIOTM is the only IC/package Co-Development tool architected from the ground up to meet the demands of today high stakes compute-intensive 3D packaging challenges.

Rome – January 12, 2021

Pop Quiz: Can you name the only True End-to-End Optimized IC/Package Co-Development Tool?

 

If you selected any of the EDA Big 3, try again.

The correct answer is:  GENIOTM from MZ Technologies.

GENIOTM is the only Holistic optimized IC/package Co-development Tool on the market today?

Why? Well, it’s because GENIOTM is the only IC/package Co-Development tool architected from the ground up to meet the demands of today high stakes compute-intensive 3D packaging challenges.  Other tools are missing some key hierarchical co-development features because functionality has been bolted on to existing architecture, rather than integrated into a design-first integrated flow.

Only GENIOTM offers all of these end-to-end optimization features.

  • Complete IC, package PCB design environment support
  • Supports 2.5D and 3D architectures
  • System-level I/O planning and optimization
  • Enables optimization across a complete system architecture
  • Interconnect optimization
  • Open standards and interfaces with all proprietary silicon and package design tools
  • Mixed silicon and photonics

GENIO’s integrated technology platform dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system.  It’s proven application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept to design, thanks to strong “what-if” analysis and system level exploration across architectures.  GENIO identifies the most proficient solution and avoids entering “dead-end” architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.
Pop Quiz: Where should you go to learn more about GENIO and MZ Technologies?

Answer: go to www.monozukuri.eu

ABOUT MONOZUKURI

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology was developed under the Horizon 2020 European project under the name of HIPER.  HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact                                              
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803

 


Copyright © 2020 Monozukuri, All rights reserved.


Our mailing address is:

Monozukuri

Via Archimede 207

RomeRM 00197

Italy


For further information, please link to the source Press Release



System Integration Key to GENIO IC/Package Co-Design Success

A proprietary system integration platform is proving the key to early trial success of MZ Technology’s GENIOTM IC/Package Co-Design EDA Tool. GENIOTM became the first commercially available IC/Package Co-Design Tool.

System Integration Key to
GENIOTM IC/Package Co-Design Success

 

Rome – Italy – November 5, 2020

A proprietary system integration platform is proving the key to early trial success of MZ Technology’s GENIOTM IC/Package Co-Design EDA Tool. GENIOTM became the first commercially available IC/Package Co-Design Tool when MZ Technologies began taking order in August.

GENIO’s proprietary fully integrated design feature is an end-to-end IC and packaging platform for 2D/2.5D/3D system design.  To date, the platform’s environment-agnostic feature has attracted early trial interest.

GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.

“While there has been a plethora of design successes in both IC and package environment the stumbling block to advanced packaging success has been finding one integrated tool that worked with equal success in both environments,” said Anna Fontanelli, Founder and CEO of MZ Technologies.  “Because it has been designed from the gate as a co-design tool GENIOTM is a total, integrated solution.

GENIOTM’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization, she explained.

GENIOTM’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

The DuetTM graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. Efficient automation allows designers to create, explore, optimize and compare different floor-planning scenarios and dynamically modify and store optimization results according to the final configuration.

For a more information, go to www.monozukuri.eu

About Monozukuri

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology was developed under the Horizon 2020 European project under the name of HIPER.  HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact                                              
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803


Copyright © 2020 Monozukuri, All rights reserved.


Our mailing address is:

Monozukuri

Via Archimede 207

RomeRM 00197

Italy


For further information, please link to the source Press Release



Monozukuri Unveils GENIO, The First Commercially-Available IC / Package Co-Design Tool

MZ TECHNOLOGIES, rebrand of Monozukuri EDA, unveiled GENIO™, the first commercially available IC/Package Co-Design Tool.

GENIO™ Available Immediately.

Monozukuri Unveils First Commercially-Available IC / Package Co-Design Tool

GENIOTM Available Immediately

 

Rome – Italy – August 25, 2020

Monozukuri S.p.A, today unveiled GENIOTM, the first commercially available IC/Package Co-Design Tool.  The company said that is able to take orders for GENIOTM now.GENIOTM is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.

GENIOTM integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.  It is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization.

“GENIOTM is not a promise or partial solution.  It is a breakthrough, ground-up tool that is ready for implementation today,” said Anna Fontanelli, Founder and CEO.

“GENIOTM’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization”, she explained.

Equally important is the fact that GENIO is agnostic to all EDA flows.  It is not a ‘bolt on’ capability like other co-design options, but a total re-conceptualizion and implementation that maximizes design efficiency across system level design.

GENIOTM ’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

The DuetTM graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. The system’s efficient automation allows designers to create, explore, optimize and compare different floor-planning, scenarios and dynamically modify and store optimization results according to the final configuration.

As an integrated IC and packaging co-design EDA tool, GENIOTM sets a new benchmark for creating heterogeneous microelectronic systems-level design for advanced applications such as artificial intelligence, virtual reality and web scale infrastructure.

For a more information, go to www.monozukuri.eu

About Monozukuri

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground breaking EDA software solutions and methodologies.
The GENIOTM technology was developed under the H2020 HIPER project. HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact                                              
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803


Copyright © 2020 Monozukuri, All rights reserved.


Our mailing address is:

Monozukuri

Via Archimede 207

RomeRM 00197

Italy


For further information, please link to the source press release



CEO Interview: Anna Fontanelli of Monozukuri

Anna Fontanelli has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies.
She presents GENIO™ product – the first commercially available IC/Package Co-Design Tool.

CEO Interview: Anna Fontanelli of Monozukuri

Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies. She has pioneered the study and development of several generations of IC and package co-design environments and has held senior positions at leading semiconductor and EDA company including STMicroelectronics and Mentor Graphics.

Candidly, I’ve never heard of Monozukuri.  Why are you guys suddenly emerging from stealth mode?
Great question. Since establishing Monozukuri in 2014, we’ve spent all of our time defining and refining our IC/package co-design system technology with a team whose broad experience stretches across system architecture, IC design and IC package design.  The team, including myself, comes from  ST Micro and Mentor. We used this time to really study the challenges.  Rather than bolt something on to an existing tools, we took the time to build a revolutionary new design platform from the ground-up.

Clearly, making promises or prematurely hyping our direction would have been counter-productive until products were fully ready.  So we quietly did the hard work and the result are a product line and a technology platform dedicated to support 3D system co-design

And, most importantly, the products are available for licensing now.

 Why is advanced packaging so important to the future of IC design?
I think the semiconductor industry is transitioning from ‘Moore’s law’ to ‘More than Moor’s law.’  So if designers are going to incorporate more functionality into smaller spaces, they’ll be beyond a single piece of silicon.  The next logical extension is to integrate multiple devices in a commercially-compelling, space-saving wrapper that optimizes system performance.

That what 2.5/3D heterogeneous integration is all about.   Each silicon component can target the ideal PPA manufacturing node.  Expensive latest technology can be reserved for only the most aggressive digital demands, while the remaining  ICs (including a silicon interposer) can target more cost and performance-efficient options.

Advanced AI system, networking products, cell phones, and wearable devices all require highly complex, small form factor systems.   Emerging 2.5/3D packages integrate highly complex multi-chip solution with tens of thousands of connections that support massive, high-speed data in a space-optimized system.

GENIO is your first co-design system.  What are some its features?
GENIO provides a holistic design environment for 2D, 2.5D and 3D multi-component systems. GENIO is actually a suite of tools that generates new levels of performance in terms of speed, optimization efficiency, and system performance.

GENIO generates system design across multiple levels and components including die, chiplet, silicon interposer, package, and PCB.  It’s  proven to eliminate dead end architectures and ensures first-time-silicon success.

The GENIO suite uses standard formats to seamlessly integrate with all existing commercial implementation platforms or dedicated plug-ins to integrate into custom EDA flows.  Its graphic interface provides an immersive 3D interactive visualization of the complete system. GENIO’s architecture also enables new standard and customized features that support both evolving tool environments and proprietary customer-specific requirements.

Which one feature do you believe is absolutely key to the future of  Co-design ?
I believe that true system co-design must be created from concept to completion by including all components from board level to chip level within the same seamless, comprehensive environment.

GENIO allows designers to consider all system components from initial high level system design exploration to detailed system integration and optimization.  This is what enables design across multiple levels and components.

A larger competitor announced that they are working on a co-development tool, yet you’re announcing GENIO is available now.  How did you get to market so quickly?

We’re seeing larger EDA companies racing to address co-design by evolving and adapting existing IC and package design tools.  That approach severely compromises overall systems functionality.

At Monozukuri, we’ve been ahead of the game since 2014.  That’s why today, we’re delivering … and I emphasize delivering …  a ground-up, integrated technology that embraces all of  the demands of  complete 3D system co-design.

We’re able to do this because GENIO is completely unconstrained.  What I mean is that GENIO works with all system components from board to chip because we built it from the ground up. It’s completely agnostic to surrounding EDA tools and it interfaces with almost all IC and package physical design tools.

You keep emphasizing immediate availability. Where’s the data to back that up?
Over the past 12 month we’ve demonstrated GENIO to multiple customers and have run a number of custom optimizations.

For instances, we successfully completed a 2.5D system feasibility analysis in 6 hours that previously took three entire teams … one for architecture, one for backend and one for package … 15 days.  That’s literal a 99.95% reduction in design time, with an associated 99.95% cost savings.

Another customer used GENIO to determine in four hours what a manual solution couldn’t accomplish in two weeks:  Discovering that a proposed IC/packaging system architecture wouldn’t work.

Finally, GENIO optimized a 2.5D HBM-based design that included a complex hierarchical ASIC … multiple hard-IP, plus multiple soft IP, plus probe pads and a complex P&G pins scheme ..  using recursive methodology within 8 hours. While the customer didn’t disclose the cycle time, we believe their traditional methodology would have taken around 45 days.

What’s the roadmap for GENIO?  When can we expect to see a full 3D tool?
Today we have a 2D and 2.5D solutions available.  The 3D platform is in final stage beta testing and is scheduled for release in the 4th quarter.

GENIO 3D includes three features essential for complete system I/O optimization:  First, the ability to manage component placement priority within the 3D stack at the architectural exploration stage. Second, TSV location management to meet manufacturing and/or customer-specific constraints. And last, complete through-stack optimization to minimize TSV population whilst managing system optimization to lessen TSV yield impact .

This is a huge undertaking and you certainly haven’t been on the VC map.  Where did you get your funding?
We financed the company using European and Institutional private equity. Through this funding we were able to complete proof-of-concept and early product development.

However, the majority of funds has come from project grants associated with European research program. Through our participation in the Horizon 2020 program we not only made significant contributions to European research, but also used the findings to complete tool development and get ourselves ready to market.

Where to from here?  When can we expect to hear more from Monozukuri?
Actually, now that we’re negotiating initial licenses, you’ll probably see a great deal of us.  While we were in stealth, we felt it necessary to decline a number of invitations to discuss our technology platform and some of the co-design challenges we all face.  Now, we’re wide open to discussing what we see as the barriers and opportunities along the co-design frontier.  We already shared our short-term roadmap, and we look forward to upholding our role as co-design innovator.


For further information, please link to the full Interview



VIEWPOINT 2020: Anna Fontanelli, CEO and Founder, Monozukuri S.p.A.

Monozukuri I/O optimization #technology – led by Founder & CEO Anna Fontanelli, heads into 2020 to develop fully optimized 2.5/3D solutions for high performance applications.

VIEWPOINT 2020: Anna Fontanelli, CEO and Founder, Monozukuri s.p.A

Heading into 2020, high end markets such as high-performance computing; gaming, including virtual reality and augmented reality, and networking will be the drivers for 2.5D and 3.D design innovation.

Applications in this markets that will find 2.5D/3D an attractive direction will include artificial intelligence, data mining, super computers, hyper scale data center operations and ultra-high-end switchers and rounders.

The year 2020 represents the mid-point in a five-year trend that should see a 27% compound annual growth rate between 2018 and 2023 for 2.5D and 3D designs, according to a consensus of industry analysts.

Monozukuri I/O optimization technology, which was launched in late 2019, is already gaining significant interest from key players looking to develop fully optimized 2.5/3D solutions for high performance applications.

Anna Fontanelli, CEO and Founder
Monozukuri s.p.A


For further information, please link to the full article



Monozukuri: Software per prodotti IoT

The magazine millionaire published an article about the winners of the latest H2020SME edition, including Monozukuri S.p.A., an European EDA Company, working in the market of early floorplanning for 2.5D-3D IC Integration.


Design e automazione per la microelettronica

After the Horizon 2020 success, Monozukuri Spa got a mention by Il Sole 24 Ore – the renowned financial newspaper.


I2i e Lazio Innova investono nella start up Monozukuri

The innovative idea of Monozukuri – company founded by Anna Fontanelli – gets an important investment from I2i and Lazio Innova.

I2i e Lazio Innova investono nella start up Monozukuri

I2i Impresa di Investimenti Innovativi SpA, insieme a Lazio Innova SpA, la finanziaria della Regione Lazio, investono in Monozukuri, la Start up che progetta microchip innovativi, fondata da Anna Fontanelli con l’idea di sviluppare nuove soluzioni software per la progettazione di sistemi integrati 2.5D e 3D di nuova generazione. Il totale dell’investimento effettuato è di 600.000 euro. Gli Investitori sono: Lazio Innova SpA, pari al 70% e I2i Spa pari al 30% dell’investimento. Inoltre, attraverso lo strumento del “Work for Equity” è prevista anche la possibilità per dipendenti di essere remunerati con partecipazione al capitale dell’impresa e di poter acquisire quote o stock option della Società, previo il raggiungimento di determinati obiettivi tecnico-economici.

Obiettivo degli investitori è quello di supportare la strutturazione dell’azienda in modo che la stessa possa essere in grado, già nel corso del 2015, di commercializzare i propri prodotti a livello internazionale, cominciando dalle grandi società multinazionali di semiconduttori (europee e israeliane), e successivamente verso il mercato americano e giapponese. I2i seguirà l’azienda sia del punto di vista gestionale, con il Presidente di I2i, Alessio Rossi, che ha assunto l’incarico di Consigliere della Società, sia come advisory finanziario, grazie al supporto di Albo Francesconi socio fondatore e Amministratore Delegato del Gruppo IN PRENDO.

L’idea innovativa di Monozukuri è sviluppare una famiglia di prodotti software dedicati all’ottimizzazione di circuiti integrati per applicazioni avanzate, in grado di rispondere alle esigenze di progettazione 2.5D e 3D. Tali prodotti sono innovativi perché, automatizzando fasi della progettazione che attualmente sono manuali o non realizzabili con i software di progettazione grafica esistenti, sono concepiti per soddisfare i 3 bisogni primari delle società di semiconduttori: la riduzione del tempo di progettazione (Time-to-Results), il raggiungimento delle prestazioni desiderate (Quality-of-Results) e la riduzione dei costi del prodotto finale (Cost-of-Results).

Attualmente Monozukuri sta completando la messa a punto del dimostratore tecnologico. Nella primavera del 2015 si chiuderà il prototipo definitivo ed entro il 2015 si arriverà alla prima versione del prodotto finito. Il piano industriale punta a un fatturato di 3,5 Milioni di euro entro cinque anni, con un EBITDA del 58%.


For further information, please link to the full article