Monozukuri to Present at DATE 3D Design Workshop
Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, will demonstrate MZ-GENIOTM, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE 2023.
Monozukuri to Present at DATE
3D Design Workshop
Rome – March 21, 2023
Will demonstrate industry’s first fully integrated
IC/Package Co-optimization Tool
Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, will demonstrate MZ-GENIOTM, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE 2023.
Ms. Fontanelli’s presentation is part of the “3D Integration: Heterogeneous 3D Architectures and Sensors” session scheduled for Wednesday, April 19th in Antwerp Belgium.
During her session, Ms. Fontanelli will show how the MZ- GENIOTM holistic design environment spans the complete 3D design ecosystem. In doing so, its co-design platform enables a revolutionary approach to integrating with physical implementation tools in both IC and Package design spaces, as well as performing signal, power integrity and thermal analysis for physical-aware and simulation-aware system interconnect optimization.
She will reveal how GENIO’s novel approach creates never-before-seen levels of IC system integration that shortens the design cycle by two orders of magnitude, drives faster time-to-manufacturing, improves yields, and streamlines the entire IC eco-system to enable function-intensive IC-designs that will be the backbone for the most advanced next-generation integrated circuits.
“With integrated circuits continuously shrinking and the evolutionary complexity of process technology, Moore’s Law is entering a bottleneck,” Ms. Fontanelli points out. “At present, 3D integration is a new hope to solve this dilemma.”
“Shrinking transistors below a 1-nanometer node gets closer to the technology’s limit. To further scale IC-functionality means moving “off chip” to vertical IC integration. This, Ms. Fontanelli explains, is the most practical way – perhaps the only way – to increase design complexity, reduce time-to-market and lower per unit costs. Certainly, it’s more economically viable than extreme miniaturization,” she claims.
GENIOTM features system architecture exploration, what-if analysis, 3D interconnect management, I/O planning and optimization, integrated within all existing EDA implementation platforms. It’s optimization algorithms tame the computational complexity of 3D designs. It supports all system architectures (2D, 2.5D, 3D configurations), all assembly styles (wire-bonding, flip-chip, and mixed) and all design flows (die-driven, package-driven, a mixture of top-down & bottom-up).
ABOUT MONOZUKURI
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
Media contact
Michele Taliercio
info@monozukuri.eu
+390686298287
GENIOTM 1.7 Further Shortens Design
GENIOTM 1.7 brings new integrated design checks and issue tracking features that reduce design time spent on this onerous step by tracking and classifying, real time, potential design process issues.
GENIOTM 1.7
Further Shortens Design
Rome – December 22, 2022
New Integrated Design Checks & Issue Tracking
Violations. Perhaps the biggest Advanced IC/Packaging system design time sink. They snarl the most elegant design. They frustrate well-conceived time-to-market schedules.
MZ Technologies feels your pain. Now, GENIOTM 1.7 brings relief with new integrated design checks and issue tracking features that reduce design time spent on this onerous step by tracking and classifying, real time, potential design process issues.
Using a dedicated always-on dock GENIOTM 1.7 alerts designers to a full list of problems classified by severity, scope, and category. This extensive check updates after any operation with new violations appearing in the “Issues Dock.”
Select an issue in the dedicated dock and all errors and warning are highlighted with a severity-driven colour across the GUI and the 2D/3D design views.
GENIOTM 1.7 performs several categories of checks. Key among them are checks on placement rules during floor planning to catch violations such as overlapping instances, out of boundary placement, and ignored keep-out zones. Other checks spot vertical routing connectivity issues, such as broken nets and crossing fly lines.
Don’t let violations boondoggle your time-to-design.
Click on this link to see how MZ Technologies GENIOTM 1.7 can reduce design time with its integrated design checks and issue tracking features.
ABOUT MONOZUKURI
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1-408-310-9244
Moore’s Law Inevitable Decline Opens New Path to IC Innovation
“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli.
Moore’s Law Inevitable Decline Opens New Path to IC Innovation
Rome – December 15, 2022
The monolithic IC give way to multiple device packages
“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli. Integrating chiplet, package and integrated circuit (IC) systems through a seamless IC/packaging co-design methodology re-opens the path to next gen IC innovation.
Ms. Fontanelli shared her prediction and resolution with semiconductor leaders recently at SemIsrael, addressing why a broad swath of the world’s population should pay attention to the growing importance of advanced packaging and 3D integration.
“With integrated circuits continuously shrinking and the continuous evolution of technological processes, Moore’s Law is entering a bottleneck,” Ms. Fontanelli pointed out. “At present, 3D integration technology is a new hope to solve this dilemma.”
Shrinking transistors below a 1-nanometer node gets closer to the technology’s limit. To further scale IC-functionality means moving “off chip” to vertical IC integration. This, Ms. Fontanelli explains, is the most practical way – perhaps the only way – to increase design complexity, reduce time-to-market and lower per unit costs. Certainly, it’s more economically viable than extreme miniaturization, she claims.
Key to this new direction is that stand-alone ICs … sensors, memories, microprocessors, and RF … can now be integrated into a single unit on configurable silicon substrates and advanced packaging technologies.
Stacking chips horizontally and vertically makes possible another step up in performance and expanding the Moore’s law. However, the move from traditional planar design to 3D integration brings many challenges.
New EDA tools, methodologies and flows must be developed to automate IC, package and ultimately the entire electronic system design process, while at the same time reducing design time, and enabling greater integration.
Ms. Fontanelli then introduced Monozukuri’s GENIOTM. GENIOTM was the first integrated IC/Packaging EDA tool on the market. It facilitates the widespread use of 3D-ICs, enabling the design of complex heterogeneous configurations. It’s advanced co-design environment integrates with traditional package and IC design tools through a standard format that streamlines the design flow.
GENIOTM features system architecture exploration, what-if analysis, 3D interconnect management, I/O planning and optimization, integrated within all existing EDA implementation platforms. It’s optimization algorithms tame the computational complexity of 3D designs. It supports all system architectures (2D, 2.5D, 3D configurations), all assembly styles (wire-bonding, flip-chip, and mixed) and all design flows (die-driven, package-driven, a mixture of top-down & bottom-up).
ABOUT MONOZUKURI
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1-408-310-9244
Monozukuri Joins Europe Horizon’s NimbleAI Project
MZ Technologies, announced that it has joined Europe Horizon’s NimbleAI Research Initiative. Know-how Critical to Project’s 3D-IC EDA Tool Set.
Monozukuri Joins Europe Horizon’s NimbleAI Project
Rome – November 17, 2022
Know-how Critical to Project’s 3D-IC EDA Tool Set
MZ Technologies, the marketing arm of Monozukuri S.p.A., today announced that it has joined Europe Horizon’s NimbleAI Research Initiative.
MZ Technologies brings to NimbleAI the first European EDA software tools and solutions for 3D design. The company, along with several partners, will support a 3D physical design feasibility study covering architecture exploration, system interconnect optimization and development of new functionalities related to timing/power/thermal analysis. The study will demonstrate the manufacturability of a 3D stacked neuromorphic sensing solution.
NimbleAI leverages energy-efficient visual sensing and processing to build upon the latest advances in integrated circuit technology and 3D stacked silicon integration, and create an integral sensing-processing neuromorphic architecture that efficiently and accurately runs computer vision algorithms in resource and area-constrained endpoint chips.
Part of the NimbleAI project is the development of EDA tools that will design the next-generation neuromorhic devices. Monozukuri’s task will be to explore currently existing methodologies for designing 3D stacked ICs and identify existing gaps and limitations. MZ will then add new functionalities to its existing baseline 3D co-design EDA tool that already delivers what-if analysis and system exploration techniques to support integration with simulation and emulation tools along with pre-manufacturing checks.
“It is a singular recognition that NimbleAI would choose MZ technologies for this very critical task, rather than rely on more well-known, traditional EDA companies. We look forward to demonstrating the visionary capabilities of our IP/chiplet co-design technology,” said Anna Fontanelli, MZ Technologies’ CEO and Founder.
ABOUT MONOZUKURI
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
MZ Technologies is partnering with Horizon Europe as part of the NimbleAI research project.
Monozukuri Names Micon Global as Business Development Representative.
MZ Technologies, the marketing arm of Monozukuri S.p.A., appoints Micon Global as its business and technology representative in Israel, Europe and Asia. The new partnership plays a key role in expanding MZ Technologies to strategically important semiconductor regions.
Monozukuri Names Micon Global as Business Development Representative
Rome – September 22, 2022
Agreement Marks an Expanded Global Presence
MZ Technologies, the marketing arm of Monozukuri S.p.A., appoints Micon Global as its business and technology representative in Israel, Europe and Asia. The new partnership plays a key role in expanding MZ Technologies to strategically important semiconductor regions.
The two companies will make GENIOTM, the first integrated silicon/packaging co-design tool, available to IC and IC Package design leading companies.
GENIOTM co-plans the final packaged device and integrated electronic circuits (ICs) in complex 2.5–3D chiplet-based hybrid configurations and was recognized by an international jury of industry experts as a revolutionary EDA co-design tool.
“Working with Micon is another step in the globalization of MZ Technology and the GENIOTM co-design tool. Micon is active in important centers of chiplet/packaging design and GENIO ‘s presence in those marketplaces will add to its growing reputation,” said Anna Fontanelli, MZ Technologies’ CEO and Founder. “We’re delighted to have Micon join us in this quest.”
“As the first integrated silicon/packaging co-design tool, GENIOTM can play an important role in the expansion of advanced packaging technology within the leading edge semiconductor and system design communities,” said Tal Oren, Micon Global’s Founder and CEO. “We are excited about this partnership and see MZ Technologies as a very significant player in these markets.”
About GENIO
Through Micon Global, MZ Technologies makes available GENIOTM 1.6, it most up-to-date software. GENIOTM 1.6 includes Parasitic Estimation and Stack Planning functionality that slash total design time and reduces overall design complexity.
Parasitic Estimation enables early-on system analysis, based on virtual routes, prior to physical implementation. Stack Planning Support automatically identifies the best 3D stack configuration, given physical and electrical constraints. It provides a more efficient chiplet-based 3D-IC system organization and electrical performance, while reducing the physical resources (TSVs) required for vertical interconnect.
About Monozukuri
MZ Technologies is the marketing function of Monozukuri S.p.A.
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
About Micon Global
Micon represents the world’s leading semiconductors, electronics and software service providers. Since 2001 Micon has been an integral part of the industry’s leading companies’ success.
With offices in Israel, the UK, Italy, France, Japan, Korea and Taiwan, we serve the EMEA and APAC territories acting as our principals’ first and local call.
CONTACTS
Our mailing address is:
Monozukuri S.p.A – Via Archimede 207, 00197 – Rome, Italy
Monozukuri Providing EU Academic Institutions Advanced EDA Tools
Monozukuri Providing EU Academic Institutions Advanced EDA Tools. Europractice agreement furthers Europe academic IC research and teaching
Monozukuri Providing EU Academic Institutions Advanced EDA Tools
Rome – July 21, 2022
Europractice agreement furthers Europe academic IC research and teaching
MZ Technologies, the marketing arm of Monozukuri S.p.A., is helping expand Europe’s strategically important semiconductor industries by providing European academic institutions with leading-edge advanced EDA design tools at substantial reduced prices.
By collaborating with Europractice Service MZ will provide GENIOTM integrated silicon/packaging co-design tools to universities and research labs throughout Europe.
GENIOTM co-plans the final device (package) and integrated electronic circuits (ICs) in complex 2.5–3D chiplet -based hybrid configurations and was recognized by an international jury of industry experts as a revolutionary EDA co-design tool.
Europractice provides academic institutions with affordable access to state-of-the art semiconductor technology for non-commercial education and research. More than 600 European academic institutions across 44 countries actively use Europractice in their teaching and research.
Monozukuri joins global IC industry icons such as ARM, Cadence, Intel, Siemens, Synopsys, and Xilinx in furthering the development of European semiconductor research and design.
“It’s our responsibility to enhance the viability of the European semiconductor industry. Partnering with Europractice give us the opportunity to train the next-generation IC engineers who’ll move this critical industry to new heights,” said Anna Fontanelli, MZ Technologies’ CEO and Founder.
“Europractice services enable European academics to more easily adopt new technologies to help them train the next generation of semiconductor engineers,” explained Mark Willoughby, Head of Europractice Design Tools. “We’re delighted that MZ Technologies is joining us in this mission.”
Through Europractice, MZ Technologies is making available GENIOTM 1.6, it most up-to-date software. GENIOTM 1.6 includes Parasitic Estimation and Stack Planning functionality that slash total design time and reduces overall design complexity.
Parasitic Estimation enables early-on system analysis, based on virtual routes, prior to physical implementation. Stack Planning Support automatically identifies the best 3D stack configuration, given physical and electrical constraints. It provides a more efficient chiplet-based 3D-IC system organization and electrical performance, while reducing the physical resources (TSVs) required for vertical interconnect.
ABOUT MONOZUKURI
MZ Technologies is the marketing function of Monozukuri S.p.A. Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
CONTACTS
Business: Michele Taliercio
michele.taliercio@monozukuri.eu
+39 335 5943100
Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244
Monozukuri Signs Strategic Investment Agreement with MARCAP
Monozukuri S.p.A. announced a capital increase with MARCAP S.p.A making an investment in the company.
Monozukuri Signs Strategic Investment Agreement with MARCAP
Rome – June 22, 2022
Funds will accelerate global growth and competitiveness
Monozukuri S.p.A. today announced a capital increase with MARCAP S.p.A making an investment in the company. Monozukuri is the developer of EDA silicon/packaging co-design software founded in 2015 by CEO Anna Fontanelli.
MARCAP S.p.A., is industrial holding company that lists among their shareholders some of the major industrial families of the Marche Italian area. The investment represents a 16% equity stake in Monozukuri.
The agreement between MARCAP and Monozukuri will help accelerate the global competitiveness of its most successful product, GENIO™, and open new markets for the software platform that reduces design time and optimizes configuration for state-of-the-art microprocessors.
As an EDA tool, GENIO co-plans the final device (package) and integrated electronic circuits (ICs) in complex 2.5–3D hybrid configurations. In 2020, GENIO became the first commercially available tool of its kind and in 2021 it was recognized by an international jury of industry experts as a revolutionary tool for EDA co-design.
“MARCAP is the ideal partner to lead us towards future growth,” said Ms. Fontanelli. “We’ve invested a lot in developing a technology platform with unique features and now we are ready to serve global markets, thanks to important contacts with major Silicon Valley companies. We will continue to enrich GENIO with new exclusive features, because chiplet technology represents the future of the microchip industry,” she explained.
“We are very pleased to support the Monozukuri team in its growth. We’re convinced that we have found unique expertise in the Italian technology market, and we’re confident in the potential that the GENIO software platform has to revolutionize the design process of a strategic sector such as semiconductors,” said Alessandro Guzzini, President of MARCAP S.p.A.
ABOUT MONOZUKURI
MZ Technologies is the marketing function of Monozukuri S.p.A. Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
CONTACTS
Business: Michele Taliercio
michele.taliercio@monozukuri.eu
+39 335 5943100
Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244
GENIO Version 1.6 Now Includes Parasitic Estimation and Stack Planning Functionalities
GENIOTM Co-Design EDA Tool Now Includes Parasitic Estimation and Stack Planning Functionalities. GENIO 1.6 Significantly Reduces Advanced Systems Total Design Time and Complexity.
GENIOTM Co-Design EDA Tool
Now Includes Parasitic Estimation
and Stack Planning Functionalities
Rome – January 18, 2022
GENIO 1.6 Significantly Reduces Advanced Systems
Total Design Time and Complexity
MZ Technologies today unveiled GENIO Version 1.6 that now includes Parasitic Estimation and Stack Planning functionalities to further slash total design time and reduces overall design complexity.
GENIOTM remains the only integrated-from-the-ground up chiplet-packaging Co-design EDA tool and the addition of the two new functions further increase its ability to meet 2.5D and 3D advanced packaging design challenges.
Parasitic Estimation enhances GENIO’s time-to-design superiority. This function enables early-on system analysis, based on virtual routes, prior to physical implementation. Parasitic Estimation is usually implemented after a chiplet-based system design and its system-level interconnects have optimized end-to-end 3D-aware signal assignment.
GENIOTM produces a pre-routing Parasitic Estimations report, based on Manhattan distances and coupled with RC and TSV/bump/C4/balls contributions, to enable early-on Static Timing Analysis. The key value is the ability to conduct static timing analysis during system exploration without waiting the results of the lengthy detailed physical routing process.
The Stack Planning Support helps designers automatically identify the best possible 3D stack configuration, given physical and electrical constraints. The new floor planning methodology provides a more efficient chiplet-based 3D-IC system organization, optimizing electrical performances and reducing the physical resources (TSVs) required for vertical interconnect.
Stack Planning provides a detailed comparison of multiple floor planning scenarios that allow the early comparison of multiple architecture configurations.
Floor plan configurations are tagged and compared. Connectivity Status dialog displays net lengths/statistics and can be filtered by Net Name, Net Group, path, sub-paths.
New 3D stack planning features are specifically designed to setup system initial configuration, improve exploration of all possible configurations, optimize and compare the most promising ones and finally suggest the optimal final solution.
In addition, Stack Planning improves manufacturability design efficiency by automating 3D-IC exploration focusing on the most promising configurations, allowing for trade-off between number/cost of TSV vs. signal path/sub-path lengths.
Below examples of 3D Stack Planning Interconnect Optimization on Selected Configurations.
GENIO Version 1.6 began beta besting in January and will be available for selected customers, full production and general availability by end of Q1 this year.
CONTACTS
Business: Michele Taliercio
michele.taliercio@monozukuri.eu
+39 335 5943100
Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244
Copyright © 2021 Monozukuri, All rights reserved
MZ Technologies Rolls Out New Technology Roadmap
MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIOTM IC/package co-design tool.
MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIOTM IC/package co-design tool.
Rome – July 29, 2021
GENIOTM became the first commercially available IC/package co-design tool when MZ Technologies began taking order in August, 2020. The roadmap calls for additional features to the current tool set. Expected in the first quarter of next year is availability of a parasitic estimation capability and stack planning support.
Parasitic Estimation and Stack Planning Support
Parasitic Estimation enhances GENIO’s time-to-design superiority. This function enables early-on system analysis, based on virtual routes, prior to physical implementation. Parasitic Estimation should be implemented after a chiplet-based system design and its system-level interconnects have optimized end-to-end 3D-aware signal assignment. Parasitic Estimation then simulates a process-static timing analysis. The more technology information that is available, the more accurate is the estimation.
Stack Planning Support helps the designer to automatically identify the best possible 3D stack configuration, given physical and thermal constraints. This new floor planning methodology provides a more efficient chiplet-based 3D-IC system organization, optimizing for effective heat dissipation and reducing the physical resources (TSVs) required for vertical interconnect.
The roadmap also identifies four other upgrades and reveals plans to introduce GENIO 2.0 sometime in 2023.
First Available Integrated Co-Design Tool
GENIO’s proprietary, fully integrated EDA co-design tool features an end-to-end IC and packaging platform for 2D/2.5D/3D system design. To date, the platform’s environment-agnostic feature has attracted significant interest, with a number of big-name companies conducting feasibility trials.
GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.
“As the company who rolled out the first commercially available co-design tool, we feel an obligation to the EDA community to continue to innovate.,” said Anna Fontanelli, Founder and CEO of MZ Technologies. “Advance packaging is clearly the pathway to keeping the spirit of Moore’s Law alive across the entire semiconductor industry spectrum.”
GENIO’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system. It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.
About Monozukuri
MZ Technologies is the marketing function of Monozukuri S.p.A. Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
CONTACTS
Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244
Business: Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803
Copyright © 2021 Monozukuri, All rights reserved
MZ Technologies Named by 3D InCites Start-up of the Year
MZ Technologies, has been named 3D InCites’ 2021 Start-up of The Year.
The 3D and heterogeneous integration technology community recognized MZ Technologies for its “innovative and much-needed design tool GENIOTM.”
MZ Technologies Named by 3D InCites
Start-up of the Year
Rome – May 6, 2021
3D InCites recognizes GENIOTM as
EDA’s Breakthrough Co-Design Tool
MZ Technologies, has been named 3D InCites’ 2021 Start-up of The Year.
The 3D and heterogeneous integration technology community recognized MZ Technologies for its “innovative and much-needed design tool GENIOTM.” GENIOTM is EDA’s first commercially available IC/Packaging Co-Design Tool.
3D InCites lauded GENIOTM for considering multiple components that enable 3D co-packaging of chips and chiplets down to the PCB level. It also pointed out that GENIOTM supports the design of 2D, 2.5D, and 3D multi-component systems and operates across multiple levels including die, chiplet, silicon interposer, package, and PCB. The announcement also recognized that GENIOTM provides three different versions specifically tuned for 2.D, 2.5D and 3D design.
“We have been hearing good things about MZ Technologies and now that GENIOTM has come to market, believed it was the appropriate time to recognize their ground-breaking accomplishments by presenting them with the 3D InCites start-up of the Year Award,” said Françoise von Trapp, 3D InCites Co-Founder.
“We are humbled and honoured to have GENIOTM recognized by a forward-looking technology advocate like 3D InCites. Their membership includes some of the biggest names in the technology space and I’m grateful that they have recognized the ‘group-up’ accomplishments of our brilliant engineering team,” said Anna Fontanelli, Founder and CEO of MZ Technologies in accepting the award.
Behind GENIO’s Success
GENIO’s proprietary fully integrated design feature is an end-to-end IC and packaging platform for 2D/2.5D/3D system design. To date, the platform’s environment-agnostic feature has attracted early trial interest.
GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.
GENIO’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization, she explained.
GENIO’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system. It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.
To learn more about GENIOTM and MZ Technologies
To learn more about the winners of the 2021 3D InCites Awards 
ABOUT MONOZUKURI
MZ Technologies is the marketing function of Monozukuri S.p.A. Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
CONTACTS
Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244
Business: Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803