Monozukuri CEO Reveals Gordon Moore’s Advanced Package Vision

Chip/Package Co-Design May Fulfill a Second “Moore’s Law”.

Opening her presentation yesterday on innovative advanced packaging approaches during the IEEE EDAPS 2023 at the Sugar Beach Resort, Republic of Mauritius, Ms. Fontanelli said that the semiconductor visionary accurately predicted stacked-die advanced packaging technology as the innovation successor to his own Moore’s law.

 

Monozukuri CEO Reveals Gordon Moore’s Advanced Package Vision

 

Rome –December 13, 2023

Chip/Package Co-Design May Fulfill a Second “Moore’s Law”

Gordon Moore predicted the demise of Moore’s law and envisioned in its place larger systems built from smaller, separately packaged, interconnected systems, according to Anna Fontanelli, Monozukuri S.p.A. CEO and Founder.

Opening her presentation yesterday on innovative advanced packaging approaches during the IEEE EDAPS 2023 Hybrid Conference, at the Sugar Beach Resort, Wolmar, Flic-en-Flac, Republic of Mauritius, Ms. Fontanelli said that the semiconductor visionary accurately predicted stacked-die advanced packaging technology as the innovation successor to his own Moore’s law. She used Moore’s long-range vision to define the Advanced Packaging landscape and outlined chiplet and package co-design challenges.

Ms. Fontanelli summarized Advanced Packaging as combining different heterogeneous integration techniques, including multi-chip modules, through silicon via 2.5 and 3D integration, fan-out wafer-level packaging, system-in-package, chiplet-based integration, and/or, system dis-aggregation and re-aggregation.  In other words, “everything but the chips,” she said.

“The most demanding IC systems today combine multiple components such as chiplets, memory and ASICs.  The package poses the challenge of handling, updating & optimizing complex interconnects in a 3D space,” Ms. Fontanelli explained.

Present-day 3D chiplet architecture demands die stacking and silicon-to-silicon vertical communications capabilities using a mix-and-match “LEGO-like” assembly.  This new chiplet packaging requires new tools, new methodologies, and new flows, she explained.

One newly available choice is MZ Technologies’ GENIOTM, the first integrated IC/Packaging EDA tool.  GENIOTM is an advanced design environment integrating traditional silicon, package, and PCB design flows in one single flow. It provides capabilities for system architecture exploration, what if analysis, and I/O planning & optimization, using proprietary algorithms that efficiently map 3D interconnects.

GENIOTM doesn’t overlap with existing technologies, rather it fills the gaps left open by of the major EDA tools.  To that end, new functionalities are related to timing/power/thermal analysis and physical manufacturability.

Ms. Fontanelli explained how the GENIOTM holistic design environment spans the complete 3D design ecosystem.  Its co-design platform enables a revolutionary approach to integrating with physical implementation tools in both IC and package design spaces, as well as performing signal, power integrity, and pre-layout thermal estimation for physical-aware and simulation-aware system interconnect optimization.

She also revealed that on a real-design test case, GENIOTM reduced architectural design time by 60X, cutting the process from three man-months to one-man day.


About Monozukuri

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact
Michele Taliercio
info@monozukuri.eu
+390686298287


For further information, please link to the source Press Release



Anna Fontanelli Defines the Future of Co-Design For SemiWiki

Monozukuri CEO, Anna Fontanelli, in a wide-ranging interview with SemiWiki editor, Dan Nenni, provided a glimpse into the future of MZ Technologies and silicon/package co-design.

 

Anna Fontanelli Defines the
Future of Co-Design For SemiWiki

 

Rome – September 13, 2023

Monozukuri CEO, Anna Fontanelli, in a wide-ranging interview with SemiWiki editor, Dan Nenni, provided a glimpse into the future of MZ Technologies and silicon/package co-design.

Read the entire interview here:

https://semiwiki.com/eda/mz-technologies/333571-ceo-interview-anna-fontanelli-of-mz-technologies/

Here’s some interview highlights:

  • “We’re making good progress toward achieving the objective we set eight years ago … we’ve our technology and generated revenue across Asia and Europe, so now it makes sense for us to bring our expertise to North America.”
  • “We’re taking on one of the industry’s thorniest problems: Creating the technology design nexus that transforms visions of the future into tomorrow’s innovative IC reality.”
  • “GENIO™ redefines the co-design of next generation heterogeneous microelectronic systems by dramatically improving the automation of integrated silicon and package EDA flows through three-dimensional interconnect optimization.”

  • “There’s nothing like GENIO today, because it was built from the ground-up.  Most of the tools that attempt to do what GENIO does are what we refer to as “bolt-ons” … capabilities are literally mashed on to another in hopes of overcoming a new set of design challenges.”
  • GENIO, is built from the ground-up.  Its system optimization from a unique dedicate cockpit that supports a 3D-aware cross-hierarchical pathfinding algorithm and a rule-based methodology that delivers single-step interconnect optimization throughout the entire 3D system hierarchy.”
  • “The next generation of GENIO will extend the tool’s front-end capabilities for simulation-aware system interconnect optimization and early-on system analysis.  The early-on system analysis capability will be very robust.  It will include state-of-the-art TSV models with R/C electrical performance and mechanical/thermal behavior.  It will also provide thermal modeling based on power dissipation map and TSVs contribution.”

About Monozukuri

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact
Michele Taliercio
info@monozukuri.eu
+390686298287



For further information, please link to the source Press Release



GENIO Tool Suite Market Adoption

MZ Technologies’ GENIOTM Tool Suite adopted for Major System-in-Package IC 

GENIOTM Tool Suite
Market Adoption

 

Rome – June 20, 2023

MZ Technologies’ GENIOTM Tool Suite
adopted 
for Major System-in-Package IC
 

An internationally respected System/ASIC company is adopting MZ Technologies’ GENIOTM 1.7 fully-integrated EDA co-design tool.

The company adopted a full-suite license and has targeted a next generation global semiconductor product family based on heterogeneous advanced technology system-in-package (SIP.)  Details of the design remain scant due to the propriety nature of the underlying technology.

The licensing agreement marks a major milestone for MZ Technologies, representing its initial entry into the broad Asian market.

“To be the co-design tool of choice in the international marketplace is a huge step forward,” said Anna Fontanelli, Founder and CEO of MZ Technologies.  “It is global confirmation of the tool’s contribution to the future of chiplet-based and advanced hybrid package design.

GENIOTM 1.7 is the first commercial integrated silicon/packaging co-design tool, available to IC and IC Package design leading companies.  Its cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

GENIOTM 1.7 co-plans the final packaged device and integrated electronic circuits (ICs) in complex 2.53D chiplet-based hybrid configurations and was recognized by an international jury of industry experts as a revolutionary EDA co-design tool.

The GENIOTM tool also easily integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems. GENIOTM 1.7 licensed under this agreement features Parasitic Estimation and Stack Planning functionality that slash total design time and reduces overall design complexity.  Parasitic Estimation enables early-on system analysis, based on virtual routes, prior to physical implementation.  Stack Planning Support automatically identifies the best 3D stack configuration, given physical and electrical constraints. It provides a more efficient chiplet-based 3D-IC system organization and electrical performance, while reducing the physical resources (TSVs) required for vertical interconnect.

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Michele Taliercio
info@monozukuri.eu
+390686298287



For further information, please link to the source Press Release



Monozukuri Cracks the Code to IC/Package Co-optimization

Demonstrate industry’s first fully integrated Tool at DATE 3D Design Workshop 

Monozukuri Cracks the Code to IC/Package Co-optimization

 

Rome – April 20, 2023

Demonstrate industry’s first fully integrated Tool
at DATE 3D Design Workshop

Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, demonstrated MZ-GENIOTM, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE on Wednesday in Antwerp Belgium.

During her session, Ms. Fontanelli showed how the MZ- GENIOTM holistic design environment spans the complete 3D design ecosystem.  In doing so, its co-design platform enables a revolutionary approach to integrating with physical implementation tools in both IC and Package design spaces, as well as performing signal, power integrity and thermal analysis for physical-aware and simulation-aware system interconnect optimization.

She also demonstrated GENIO’s novel approach to creating never-before-seen levels of IC system integration that shortens the design cycle by two orders of magnitude, drives faster time-to-manufacturing, improves yields, and streamlines the entire IC eco-system to enable function-intensive IC-designs that will be the backbone for the most advanced next-generation integrated circuits.

“Shrinking transistors below a 1-nanometer node gets closer to the technology’s limit.  To further scale IC-functionality means moving “off chip” to vertical IC integration. This, Ms. Fontanelli explains, is the most practical way – perhaps the only way – to increase design complexity, reduce time-to-market and lower per unit costs.  Certainly, it’s more economically viable than extreme miniaturization,” she claims.

During her demonstration, Ms. Fontanelli offered the work that MZ Technologies is doing on Europe Horizon’s NibleAI Research Initiative as proof of GENIO’s capabilities.

For this project, the 3D EDA tool supports technology-aware 3D physical architecture exploration across layers, a chiplet based floor planning approach enabling the use of multiple IP libraries to quickly explore different combinations of components and system configurations to find the most efficient component stack, and discover interconnection solution with the smallest footprint.  Key is the fact that the tool remains agnostic to the different nature of the components and other tools used implementation and simulation, she explained.

GENIOTM features system architecture exploration, what-if analysis, 3D interconnect management, I/O planning and optimization, integrated within all existing EDA implementation platforms.  It’s optimization algorithms tame the computational complexity of 3D designs. It supports all system architectures (2D, 2.5D, 3D configurations), all assembly styles (wire-bonding, flip-chip, and mixed) and all design flows (die-driven, package-driven, a mixture of top-down & bottom-up).

 

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Michele Taliercio
info@monozukuri.eu
+390686298287



For further information, please link to the source Press Release



Monozukuri to Present at DATE 3D Design Workshop

Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, will demonstrate MZ-GENIOTM, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE 2023.

Monozukuri to Present at DATE
3D Design Workshop

Rome – March 21, 2023

Will demonstrate industry’s first fully integrated
IC/Package Co-optimization Tool  

Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, will demonstrate MZ-GENIOTM, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE 2023.

Ms. Fontanelli’s presentation is part of the “3D Integration: Heterogeneous 3D Architectures and Sensors” session scheduled for Wednesday, April 19th in Antwerp Belgium.

During her session, Ms. Fontanelli will show how the MZ- GENIOTM holistic design environment spans the complete 3D design ecosystem.  In doing so, its co-design platform enables a revolutionary approach to integrating with physical implementation tools in both IC and Package design spaces, as well as performing signal, power integrity and thermal analysis for physical-aware and simulation-aware system interconnect optimization.

She will reveal how GENIO’s novel approach creates never-before-seen levels of IC system integration that shortens the design cycle by two orders of magnitude, drives faster time-to-manufacturing, improves yields, and streamlines the entire IC eco-system to enable function-intensive IC-designs that will be the backbone for the most advanced next-generation integrated circuits.

“With integrated circuits continuously shrinking and the evolutionary complexity of process technology, Moore’s Law is entering a bottleneck,” Ms. Fontanelli points out. “At present, 3D integration is a new hope to solve this dilemma.”

“Shrinking transistors below a 1-nanometer node gets closer to the technology’s limit.  To further scale IC-functionality means moving “off chip” to vertical IC integration. This, Ms. Fontanelli explains, is the most practical way – perhaps the only way – to increase design complexity, reduce time-to-market and lower per unit costs.  Certainly, it’s more economically viable than extreme miniaturization,” she claims.

GENIOTM features system architecture exploration, what-if analysis, 3D interconnect management, I/O planning and optimization, integrated within all existing EDA implementation platforms.  It’s optimization algorithms tame the computational complexity of 3D designs. It supports all system architectures (2D, 2.5D, 3D configurations), all assembly styles (wire-bonding, flip-chip, and mixed) and all design flows (die-driven, package-driven, a mixture of top-down & bottom-up).

 

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Michele Taliercio
info@monozukuri.eu
+390686298287



For further information, please link to the source Press Release 



GENIOTM 1.7 Further Shortens Design

GENIOTM 1.7 brings new integrated design checks and issue tracking features that reduce design time spent on this onerous step by tracking and classifying, real time, potential design process issues.

GENIOTM 1.7
Further Shortens Design

Rome – December 22, 2022

New Integrated Design Checks & Issue Tracking

 Violations.  Perhaps the biggest Advanced IC/Packaging system design time sink.  They snarl the most elegant design.  They frustrate well-conceived time-to-market schedules.

MZ Technologies feels your pain.  Now, GENIOTM 1.7 brings relief with new integrated design checks and issue tracking features that reduce design time spent on this onerous step by tracking and classifying, real time, potential design process issues.

Using a dedicated always-on dock GENIOTM 1.7 alerts designers to a full list of problems classified by severity, scope, and category. This extensive check updates after any operation with new violations appearing in the “Issues Dock.”

Select an issue in the dedicated dock and all errors and warning are highlighted with a severity-driven colour across the GUI and the 2D/3D design views.

GENIOTM 1.7 performs several categories of checks.  Key among them are checks on placement rules during floor planning to catch violations such as overlapping instances, out of boundary placement, and ignored keep-out zones.  Other checks spot vertical routing connectivity issues, such as broken nets and crossing fly lines.

Don’t let violations boondoggle your time-to-design.

Click on this link to see how MZ Technologies GENIOTM 1.7 can reduce design time with its integrated design checks and issue tracking features.

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1-408-310-9244



For further information, please link to the source Press Release 



Moore’s Law Inevitable Decline Opens New Path to IC Innovation

“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli.

Moore’s Law Inevitable Decline Opens New Path to IC Innovation

Rome – December 15, 2022

The monolithic IC give way to multiple device packages  

“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli. Integrating chiplet, package and integrated circuit (IC) systems through a seamless IC/packaging co-design methodology re-opens the path to next gen IC innovation.

Ms. Fontanelli shared her prediction and resolution with semiconductor leaders recently at SemIsrael, addressing why a broad swath of the world’s population should pay attention to the growing importance of advanced packaging and 3D integration.

“With integrated circuits continuously shrinking and the continuous evolution of technological processes, Moore’s Law is entering a bottleneck,” Ms. Fontanelli pointed out. “At present, 3D integration technology is a new hope to solve this dilemma.”

Shrinking transistors below a 1-nanometer node gets closer to the technology’s limit.  To further scale IC-functionality means moving “off chip” to vertical IC integration. This, Ms. Fontanelli explains, is the most practical way – perhaps the only way – to increase design complexity, reduce time-to-market and lower per unit costs.  Certainly, it’s more economically viable than extreme miniaturization, she claims.

Key to this new direction is that stand-alone ICs … sensors, memories, microprocessors, and RF … can now be integrated into a single unit on configurable silicon substrates and advanced packaging technologies.

Stacking chips horizontally and vertically makes possible another step up in performance and expanding the Moore’s law.  However, the move from traditional planar design to 3D integration brings many challenges.

New EDA tools, methodologies and flows must be developed to automate IC, package and ultimately the entire electronic system design process, while at the same time reducing design time, and enabling greater integration.

Ms. Fontanelli then introduced Monozukuri’s GENIOTM.  GENIOTM was the first integrated IC/Packaging EDA tool on the market.  It facilitates the widespread use of 3D-ICs, enabling the design of complex heterogeneous configurations.  It’s advanced co-design environment integrates with traditional package and IC design tools through a standard format that streamlines the design flow.

GENIOTM features system architecture exploration, what-if analysis, 3D interconnect management, I/O planning and optimization, integrated within all existing EDA implementation platforms.  It’s optimization algorithms tame the computational complexity of 3D designs. It supports all system architectures (2D, 2.5D, 3D configurations), all assembly styles (wire-bonding, flip-chip, and mixed) and all design flows (die-driven, package-driven, a mixture of top-down & bottom-up).

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1-408-310-9244



For further information, please link to the source Press Release 



Monozukuri Joins Europe Horizon’s NimbleAI Project

MZ Technologies, announced that it has joined Europe Horizon’s NimbleAI Research Initiative. Know-how Critical to Project’s 3D-IC EDA Tool Set.

Monozukuri Joins Europe Horizon’s NimbleAI Project

Rome – November 17, 2022

Know-how Critical to Project’s 3D-IC EDA Tool Set  

MZ Technologies, the marketing arm of Monozukuri S.p.A., today announced that it has joined Europe Horizon’s NimbleAI Research Initiative.

MZ Technologies brings to NimbleAI the first European EDA software tools and solutions for 3D design. The company, along with several partners, will support a 3D physical design feasibility study covering architecture exploration, system interconnect optimization and development of new functionalities related to timing/power/thermal analysis.  The study will demonstrate the manufacturability of a 3D stacked neuromorphic sensing solution.

NimbleAI leverages energy-efficient visual sensing and processing to build upon the latest advances in integrated circuit technology and 3D stacked silicon integration, and create an integral sensing-processing neuromorphic architecture that efficiently and accurately runs computer vision algorithms in resource and area-constrained endpoint chips.

Part of the NimbleAI project is the development of EDA tools that will design the next-generation neuromorhic devices.  Monozukuri’s task will be to explore currently existing methodologies for designing 3D stacked ICs and identify existing gaps and limitations. MZ will then add new functionalities to its existing baseline 3D co-design EDA tool that already delivers what-if analysis and system exploration techniques to support integration with simulation and emulation tools along with pre-manufacturing checks.

 

“It is a singular recognition that NimbleAI would choose MZ technologies for this very critical task, rather than rely on more well-known, traditional EDA companies.  We look forward to demonstrating the visionary capabilities of our IP/chiplet co-design technology,” said Anna Fontanelli, MZ Technologies’ CEO and Founder.

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


 

 

 

MZ Technologies is partnering with Horizon Europe as part of the NimbleAI research project.


 


For further information, please link to the source Press Release



Monozukuri Names Micon Global as Business Development Representative.

MZ Technologies, the marketing arm of Monozukuri S.p.A., appoints Micon Global as its business and technology representative in Israel, Europe and Asia.  The new partnership plays a key role in expanding MZ Technologies to strategically important semiconductor regions.

Monozukuri Names Micon Global as Business Development Representative

 

Rome – September 22, 2022

 

Agreement Marks an Expanded Global Presence 

MZ Technologies, the marketing arm of Monozukuri S.p.A., appoints Micon Global as its business and technology representative in Israel, Europe and Asia.  The new partnership plays a key role in expanding MZ Technologies to strategically important semiconductor regions.

The two companies will make GENIOTM, the first integrated silicon/packaging co-design tool, available to IC and IC Package design leading companies.

GENIOTM co-plans the final packaged device and integrated electronic circuits (ICs) in complex 2.53D chiplet-based hybrid configurations and was recognized by an international jury of industry experts as a revolutionary EDA co-design tool.

“Working with Micon is another step in the globalization of MZ Technology and the GENIOTM co-design tool.  Micon is active in important centers of chiplet/packaging design and GENIO ‘s presence in those marketplaces will add to its growing reputation,” said Anna Fontanelli, MZ Technologies’ CEO and Founder. “We’re delighted to have Micon join us in this quest.”

“As the first integrated silicon/packaging co-design tool, GENIOTM can play an important role in the expansion of advanced packaging technology within the leading edge semiconductor and system design communities,” said Tal Oren, Micon Global’s Founder and CEO.  “We are excited about this partnership and see MZ Technologies as a very significant player in  these markets.”

About GENIO

Through Micon Global, MZ Technologies makes available GENIOTM 1.6, it most up-to-date software. GENIOTM 1.6 includes Parasitic Estimation and Stack Planning functionality that slash total design time and reduces overall design complexity.
Parasitic Estimation enables early-on system analysis, based on virtual routes, prior to physical implementation.  Stack Planning Support automatically identifies the best 3D stack configuration, given physical and electrical constraints. It provides a more efficient chiplet-based 3D-IC system organization and electrical performance, while reducing the physical resources (TSVs) required for vertical interconnect.

About Monozukuri

MZ Technologies is the marketing function of Monozukuri S.p.A.
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

About Micon Global

Micon represents the world’s leading semiconductors, electronics and software service providers. Since 2001 Micon has been an integral part of the industry’s leading companies’ success.
With offices in Israel, the UK, Italy, France, Japan, Korea and Taiwan, we serve the EMEA and APAC territories acting as our principals’ first and local call.


CONTACTS

Our mailing address is:

Monozukuri S.p.A – Via Archimede 207, 00197 – Rome, Italy

info@monozukuri.eu


For further information, please link to the source Press Release



Monozukuri Providing EU Academic Institutions Advanced EDA Tools

Monozukuri Providing EU Academic Institutions Advanced EDA Tools. Europractice agreement furthers Europe academic IC research and teaching

 

Monozukuri Providing EU Academic Institutions Advanced EDA Tools

 

Rome – July 21, 2022

Europractice agreement furthers Europe academic IC research and teaching

MZ Technologies, the marketing arm of Monozukuri S.p.A., is helping expand Europe’s strategically important semiconductor industries by providing European academic institutions with leading-edge advanced EDA design tools at substantial reduced prices.

By collaborating with Europractice Service MZ will provide GENIOTM integrated silicon/packaging co-design tools to universities and research labs throughout Europe.

GENIOTM  co-plans the final device (package) and integrated electronic circuits (ICs) in complex 2.53D chiplet -based hybrid configurations and was recognized by an international jury of industry experts as a revolutionary EDA co-design tool.

Europractice provides academic institutions with affordable access to state-of-the art semiconductor technology for non-commercial education and research.  More than 600 European academic institutions across 44 countries actively use Europractice in their teaching and research.

Monozukuri joins global IC industry icons such as ARM, Cadence, Intel, Siemens, Synopsys, and Xilinx in furthering the development of European semiconductor research and design.

“It’s our responsibility to enhance the viability of the European semiconductor industry.  Partnering with Europractice give us the opportunity to train the next-generation IC engineers who’ll move this critical industry to new heights,” said Anna Fontanelli, MZ Technologies’ CEO and Founder.

“Europractice services enable European academics to more easily adopt new technologies to help them train the next generation of semiconductor engineers,” explained Mark Willoughby, Head of Europractice Design Tools.  “We’re delighted that MZ Technologies is joining us in this mission.”

Through Europractice, MZ Technologies is making available GENIOTM 1.6, it most up-to-date software. GENIOTM 1.6 includes Parasitic Estimation and Stack Planning functionality that slash total design time and reduces overall design complexity.

Parasitic Estimation enables early-on system analysis, based on virtual routes, prior to physical implementation.  Stack Planning Support automatically identifies the best 3D stack configuration, given physical and electrical constraints. It provides a more efficient chiplet-based 3D-IC system organization and electrical performance, while reducing the physical resources (TSVs) required for vertical interconnect.

ABOUT MONOZUKURI

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


CONTACTS

Business: Michele Taliercio
michele.taliercio@monozukuri.eu
+39 335 5943100

Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244


For further information, please link to the source Press Release