Monozukuri Signs Strategic Investment Agreement with MARCAP

Monozukuri S.p.A. announced a capital increase with MARCAP S.p.A making an investment in the company.

Monozukuri Signs Strategic Investment Agreement with MARCAP

 

Rome – June 22, 2022

 

Funds will accelerate global growth and competitiveness

Monozukuri S.p.A. today announced a capital increase with MARCAP S.p.A making an investment in the company. Monozukuri is the developer of EDA silicon/packaging co-design software founded in 2015 by CEO Anna Fontanelli.

MARCAP S.p.A., is industrial holding company that lists among their shareholders some of the major industrial families of the Marche Italian area.  The investment represents a 16% equity stake in Monozukuri.

The agreement between MARCAP and Monozukuri will help accelerate the global  competitiveness of its most successful product, GENIO™, and open new markets for the software platform that reduces design time and optimizes configuration for state-of-the-art microprocessors.

As an EDA tool, GENIO co-plans the final device (package) and integrated electronic circuits (ICs)  in complex 2.53D hybrid configurations. In 2020, GENIO became the first commercially available tool of its kind and in 2021 it was recognized by an international jury of industry experts as a revolutionary tool for EDA co-design.

“MARCAP is the ideal partner to lead us towards future growth,” said Ms. Fontanelli. “We’ve invested a lot in developing a technology platform with unique features and now we are ready to serve global markets, thanks to important contacts with major Silicon Valley companies. We will continue to enrich GENIO with new exclusive features, because chiplet technology represents the future of the microchip industry,” she explained.

“We are very pleased to support the Monozukuri team in its growth.  We’re convinced that we have found unique expertise in the Italian technology market, and we’re confident in the potential that the GENIO software platform has to revolutionize the design process of a strategic sector such as semiconductors,” said Alessandro Guzzini, President of MARCAP S.p.A.

ABOUT MONOZUKURI

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


CONTACTS

Business: Michele Taliercio
michele.taliercio@monozukuri.eu
+39 335 5943100

Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244


Copyright © 2021 Monozukuri, All rights reserved


For further information, please link to the source Press Release



GENIO Version 1.6 Now Includes Parasitic Estimation and Stack Planning Functionalities

GENIOTM Co-Design EDA Tool Now Includes Parasitic Estimation and Stack Planning Functionalities. GENIO 1.6 Significantly Reduces Advanced Systems Total Design Time and Complexity.

GENIOTM Co-Design EDA Tool
Now Includes Parasitic Estimation
and Stack Planning Functionalities

 

Rome – January 18, 2022

GENIO 1.6 Significantly Reduces Advanced Systems
Total Design Time and Complexity

MZ Technologies today unveiled GENIO Version 1.6 that now includes Parasitic Estimation and Stack Planning functionalities to further slash total design time and reduces overall design complexity.

GENIOTM remains the only integrated-from-the-ground up chiplet-packaging Co-design EDA tool and the addition of the two new functions further increase its ability to meet 2.5D and 3D advanced packaging design challenges.

Parasitic Estimation enhances GENIO’s time-to-design superiority.  This function enables early-on system analysis, based on virtual routes, prior to physical implementation. Parasitic Estimation is usually implemented after a chiplet-based system design and its system-level interconnects have optimized end-to-end 3D-aware signal assignment.

GENIOTM produces a pre-routing Parasitic Estimations report, based on Manhattan distances and coupled with RC and TSV/bump/C4/balls contributions, to enable early-on Static Timing Analysis.  The key value is the ability to conduct static timing analysis during system exploration without waiting the results of the lengthy detailed physical routing process.

The Stack Planning Support helps designers automatically identify the best possible 3D stack configuration, given physical and electrical constraints. The new floor planning methodology provides a more efficient chiplet-based 3D-IC system organization, optimizing electrical performances and reducing the physical resources (TSVs) required for vertical interconnect.

Stack Planning provides a detailed comparison of multiple floor planning scenarios that allow the early comparison of multiple architecture configurations.

Floor plan configurations are tagged and compared. Connectivity Status dialog displays net lengths/statistics and can be filtered by Net Name, Net Group, path, sub-paths.

 

New 3D stack planning features are specifically designed to setup system initial configuration, improve exploration of all possible configurations, optimize and compare the most promising ones and finally suggest the optimal final solution.

In addition, Stack Planning improves manufacturability design efficiency by automating 3D-IC exploration focusing on the most promising configurations, allowing for trade-off between number/cost of TSV vs. signal path/sub-path lengths.

Below examples of 3D Stack Planning Interconnect Optimization on Selected Configurations.

GENIO Version 1.6 began beta besting in January and will be available for selected customers, full production and general availability by end of Q1 this year.


CONTACTS

Business: Michele Taliercio
michele.taliercio@monozukuri.eu
+39 335 5943100

Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244


Copyright © 2021 Monozukuri, All rights reserved


For further information, please link to the source Press Release



MZ Technologies Rolls Out New Technology Roadmap

MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIOTM IC/package co-design tool.

MZ Technologies has released its roadmap for its device/packaging Co-Design EDA tools that lays out an agenda of added features and reveals plans for generation 2.0 GENIOTM IC/package co-design tool.

 

Rome – July 29, 2021

GENIOTM became the first commercially available IC/package co-design tool when MZ Technologies began taking order in August, 2020.  The roadmap calls for additional features to the current tool set.  Expected in the first quarter of next year is availability of a parasitic estimation capability and stack planning support.

Parasitic Estimation and Stack Planning Support

Parasitic Estimation enhances GENIO’s time-to-design superiority.  This function enables early-on system analysis, based on virtual routes, prior to physical implementation. Parasitic Estimation should be implemented after a chiplet-based system design and its system-level interconnects have optimized end-to-end 3D-aware signal assignment. Parasitic Estimation then simulates a process-static timing analysis.  The more technology information that is available, the more accurate is the estimation.

Stack Planning Support helps the designer to automatically identify the best possible 3D stack configuration, given physical and thermal constraints. This new floor planning methodology provides a more efficient chiplet-based 3D-IC system organization, optimizing for effective heat dissipation and reducing the physical resources (TSVs) required for vertical interconnect.

The roadmap also identifies four other upgrades and reveals plans to introduce GENIO 2.0 sometime in 2023.

 

First Available Integrated Co-Design Tool

GENIO’s proprietary, fully integrated EDA co-design tool features an end-to-end IC and packaging platform for 2D/2.5D/3D system design.  To date, the platform’s environment-agnostic feature has attracted significant interest, with a number of big-name companies conducting feasibility trials.
GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.
“As the company who rolled out the first commercially available co-design tool, we feel an obligation to the EDA community to continue to innovate.,” said Anna Fontanelli, Founder and CEO of MZ Technologies.  “Advance packaging is clearly the pathway to keeping the spirit of Moore’s Law alive across the entire semiconductor industry spectrum.”
GENIO’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

About Monozukuri

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


CONTACTS

Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business: Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803


Copyright © 2021 Monozukuri, All rights reserved



For further information, please link to the source Press Release



MZ Technologies Named by 3D InCites Start-up of the Year

MZ Technologies, has been named 3D InCites’ 2021 Start-up of The Year.
The 3D and heterogeneous integration technology community recognized MZ Technologies for its “innovative and much-needed design tool GENIOTM.”

 MZ Technologies Named by 3D InCites
Start-up of the Year

 

Rome – May 6, 2021

3D InCites recognizes GENIOTM as
EDA’s Breakthrough Co-Design Tool

MZ Technologies, has been named 3D InCites’ 2021 Start-up of The Year.

The 3D and heterogeneous integration technology community recognized MZ Technologies for its “innovative and much-needed design tool GENIOTM.”  GENIOTM is EDA’s first commercially available IC/Packaging Co-Design Tool.

3D InCites lauded GENIOTM for considering multiple components that enable 3D co-packaging of chips and chiplets down to the PCB level. It also pointed out that GENIOTM supports the design of 2D, 2.5D, and 3D multi-component systems and operates across multiple levels including die, chiplet, silicon interposer, package, and PCB. The announcement also recognized that GENIOTM provides three different versions specifically tuned for 2.D, 2.5D and 3D design.

“We have been hearing good things about MZ Technologies and now that GENIOTM has come to market, believed it was the appropriate time to recognize their ground-breaking accomplishments by presenting them with the 3D InCites start-up of the Year Award,” said Françoise von Trapp, 3D InCites Co-Founder.

“We are humbled and honoured to have GENIOTM recognized by a forward-looking technology advocate like 3D InCites.  Their membership includes some of the biggest names in the technology space and I’m grateful that they have recognized the ‘group-up’ accomplishments of our brilliant engineering team,” said Anna Fontanelli, Founder and CEO of MZ Technologies in accepting the award.

Behind GENIO’s Success

GENIO’s proprietary fully integrated design feature is an end-to-end IC and packaging platform for 2D/2.5D/3D system design.  To date, the platform’s environment-agnostic feature has attracted early trial interest.

GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.

GENIO’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization, she explained.

GENIO’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

To learn more about GENIOTM and MZ Technologies

To learn more about the winners of the 2021 3D InCites Awards

 


ABOUT MONOZUKURI

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


CONTACTS

Media: Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business: Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803


For further information, please link to the source Press Release



GENIO IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization

AiThority mentions GENIO™ as the first EDA design tool to offer end-to-end optimitazion.

GENIO IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization

 

MZ Technologies underscored several key IC/package co-design features that are critical to meeting today’s high-performance advanced technology IC device needs. The company’s GENIO IC/Package Co-Design EDA tool is the industry’s only end-toend optimized solution that covers all the requirements.

Visionary IC systems designers have identied seven key features that should be incorporated into the ideal integrated IC/package co-design tool. These include: IC, package PCB design environment support, system-level I/O planning and optimization, a holistic design environment, mixed silicon and photonics, interconnect optimization, open standards, and tool agnostic work fows.

GENIO is the only EDA tool that provides all seven, integrating silicon and package EDA flows to create a full co-design and end-to-end optimized design environment for complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.

“The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution.  Because we imagined and built the technology platform from the ground up, GENIO is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.

“The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution. Because we imagined and built the technology platform from the ground up, GENIO is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.

GENIO’s holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system.  It has proven to be very application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept-to-design methodology, thanks to strong “what-if” analysis and system level exploration across architectures.  GENIO identifies the most proficient solution and avoids entering “dead-end” architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.

GENIO also eliminates design environment boundaries to enable system architectural exploration that identifies errors and bottleneck early in the design process. It also features cross-hierarchical pathfinding for pin assignment optimization, wire lengths/crossovers reduction, and floor planning-aware silicon interposer design.


For further information, please link to the full Article



EDA TOOL FOR HETEROGENEOUS SYSTEMS

EE Times Europe mentions the GENIO™ EDA design tool as the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems.

EDA TOOL FOR HETEROGENEOUS SYSTEMS

On the tools and software front, a new EDA design tool is claimed to be the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems. The GENIO tool, from Rome-based startup Monozukuri Technologies, integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multichip designs that comprise advanced heterogeneous microelectronic systems. GENIO is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization, according to the company.

The cross-hierarchical, 3D-aware design methodologies streamline the IC ecosystem, integrating IC and advanced packaging design to ensure full system-level optimization, shortening the design cycles, accelerating time to manufacturing, and improving yields. The industry is moving to heterogeneous integration to overcome the limitations of Moore’s Law in enhancing performance. But the diverse nature of silicon and package technologies and the use of highspeed interconnections call for enhancements in co-design capabilities to enable planning, implementation, and analysis across different engineering domains as well as to provide a complete, consistent model across tool platforms.


For further information, please link to the complete Article



End-to-End Optimization

Pop Quiz: Can you name the only True End-to-End Optimized IC/Package Co-Development Tool?

The correct answer is:  GENIOTM from MZ Technologies.

GENIOTM is the only IC/package Co-Development tool architected from the ground up to meet the demands of today high stakes compute-intensive 3D packaging challenges.

Rome – January 12, 2021

Pop Quiz: Can you name the only True End-to-End Optimized IC/Package Co-Development Tool?

 

If you selected any of the EDA Big 3, try again.

The correct answer is:  GENIOTM from MZ Technologies.

GENIOTM is the only Holistic optimized IC/package Co-development Tool on the market today?

Why? Well, it’s because GENIOTM is the only IC/package Co-Development tool architected from the ground up to meet the demands of today high stakes compute-intensive 3D packaging challenges.  Other tools are missing some key hierarchical co-development features because functionality has been bolted on to existing architecture, rather than integrated into a design-first integrated flow.

Only GENIOTM offers all of these end-to-end optimization features.

  • Complete IC, package PCB design environment support
  • Supports 2.5D and 3D architectures
  • System-level I/O planning and optimization
  • Enables optimization across a complete system architecture
  • Interconnect optimization
  • Open standards and interfaces with all proprietary silicon and package design tools
  • Mixed silicon and photonics

GENIO’s integrated technology platform dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system.  It’s proven application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept to design, thanks to strong “what-if” analysis and system level exploration across architectures.  GENIO identifies the most proficient solution and avoids entering “dead-end” architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.
Pop Quiz: Where should you go to learn more about GENIO and MZ Technologies?

Answer: go to www.monozukuri.eu

ABOUT MONOZUKURI

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology was developed under the Horizon 2020 European project under the name of HIPER.  HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact                                              
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803

 


Copyright © 2020 Monozukuri, All rights reserved.


Our mailing address is:

Monozukuri

Via Archimede 207

RomeRM 00197

Italy


For further information, please link to the source Press Release



System Integration Key to GENIO IC/Package Co-Design Success

A proprietary system integration platform is proving the key to early trial success of MZ Technology’s GENIOTM IC/Package Co-Design EDA Tool. GENIOTM became the first commercially available IC/Package Co-Design Tool.

System Integration Key to
GENIOTM IC/Package Co-Design Success

 

Rome – Italy – November 5, 2020

A proprietary system integration platform is proving the key to early trial success of MZ Technology’s GENIOTM IC/Package Co-Design EDA Tool. GENIOTM became the first commercially available IC/Package Co-Design Tool when MZ Technologies began taking order in August.

GENIO’s proprietary fully integrated design feature is an end-to-end IC and packaging platform for 2D/2.5D/3D system design.  To date, the platform’s environment-agnostic feature has attracted early trial interest.

GENIOTM integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.

“While there has been a plethora of design successes in both IC and package environment the stumbling block to advanced packaging success has been finding one integrated tool that worked with equal success in both environments,” said Anna Fontanelli, Founder and CEO of MZ Technologies.  “Because it has been designed from the gate as a co-design tool GENIOTM is a total, integrated solution.

GENIOTM’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization, she explained.

GENIOTM’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

The DuetTM graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. Efficient automation allows designers to create, explore, optimize and compare different floor-planning scenarios and dynamically modify and store optimization results according to the final configuration.

For a more information, go to www.monozukuri.eu

About Monozukuri

MZ Technologies is the marketing function of Monozukuri S.p.A.  Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology was developed under the Horizon 2020 European project under the name of HIPER.  HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact                                              
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803


Copyright © 2020 Monozukuri, All rights reserved.


Our mailing address is:

Monozukuri

Via Archimede 207

RomeRM 00197

Italy


For further information, please link to the source Press Release



Monozukuri Unveils GENIO, The First Commercially-Available IC / Package Co-Design Tool

MZ TECHNOLOGIES, rebrand of Monozukuri EDA, unveiled GENIO™, the first commercially available IC/Package Co-Design Tool.

GENIO™ Available Immediately.

Monozukuri Unveils First Commercially-Available IC / Package Co-Design Tool

GENIOTM Available Immediately

 

Rome – Italy – August 25, 2020

Monozukuri S.p.A, today unveiled GENIOTM, the first commercially available IC/Package Co-Design Tool.  The company said that is able to take orders for GENIOTM now.GENIOTM is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.

GENIOTM integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.  It is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization.

“GENIOTM is not a promise or partial solution.  It is a breakthrough, ground-up tool that is ready for implementation today,” said Anna Fontanelli, Founder and CEO.

“GENIOTM’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization”, she explained.

Equally important is the fact that GENIO is agnostic to all EDA flows.  It is not a ‘bolt on’ capability like other co-design options, but a total re-conceptualizion and implementation that maximizes design efficiency across system level design.

GENIOTM ’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system.  It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

The DuetTM graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. The system’s efficient automation allows designers to create, explore, optimize and compare different floor-planning, scenarios and dynamically modify and store optimization results according to the final configuration.

As an integrated IC and packaging co-design EDA tool, GENIOTM sets a new benchmark for creating heterogeneous microelectronic systems-level design for advanced applications such as artificial intelligence, virtual reality and web scale infrastructure.

For a more information, go to www.monozukuri.eu

About Monozukuri

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground breaking EDA software solutions and methodologies.
The GENIOTM technology was developed under the H2020 HIPER project. HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact                                              
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact                                              
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803


Copyright © 2020 Monozukuri, All rights reserved.


Our mailing address is:

Monozukuri

Via Archimede 207

RomeRM 00197

Italy


For further information, please link to the source press release



CEO Interview: Anna Fontanelli of Monozukuri

Anna Fontanelli has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies.
She presents GENIO™ product – the first commercially available IC/Package Co-Design Tool.

CEO Interview: Anna Fontanelli of Monozukuri

Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies. She has pioneered the study and development of several generations of IC and package co-design environments and has held senior positions at leading semiconductor and EDA company including STMicroelectronics and Mentor Graphics.

Candidly, I’ve never heard of Monozukuri.  Why are you guys suddenly emerging from stealth mode?
Great question. Since establishing Monozukuri in 2014, we’ve spent all of our time defining and refining our IC/package co-design system technology with a team whose broad experience stretches across system architecture, IC design and IC package design.  The team, including myself, comes from  ST Micro and Mentor. We used this time to really study the challenges.  Rather than bolt something on to an existing tools, we took the time to build a revolutionary new design platform from the ground-up.

Clearly, making promises or prematurely hyping our direction would have been counter-productive until products were fully ready.  So we quietly did the hard work and the result are a product line and a technology platform dedicated to support 3D system co-design

And, most importantly, the products are available for licensing now.

 Why is advanced packaging so important to the future of IC design?
I think the semiconductor industry is transitioning from ‘Moore’s law’ to ‘More than Moor’s law.’  So if designers are going to incorporate more functionality into smaller spaces, they’ll be beyond a single piece of silicon.  The next logical extension is to integrate multiple devices in a commercially-compelling, space-saving wrapper that optimizes system performance.

That what 2.5/3D heterogeneous integration is all about.   Each silicon component can target the ideal PPA manufacturing node.  Expensive latest technology can be reserved for only the most aggressive digital demands, while the remaining  ICs (including a silicon interposer) can target more cost and performance-efficient options.

Advanced AI system, networking products, cell phones, and wearable devices all require highly complex, small form factor systems.   Emerging 2.5/3D packages integrate highly complex multi-chip solution with tens of thousands of connections that support massive, high-speed data in a space-optimized system.

GENIO is your first co-design system.  What are some its features?
GENIO provides a holistic design environment for 2D, 2.5D and 3D multi-component systems. GENIO is actually a suite of tools that generates new levels of performance in terms of speed, optimization efficiency, and system performance.

GENIO generates system design across multiple levels and components including die, chiplet, silicon interposer, package, and PCB.  It’s  proven to eliminate dead end architectures and ensures first-time-silicon success.

The GENIO suite uses standard formats to seamlessly integrate with all existing commercial implementation platforms or dedicated plug-ins to integrate into custom EDA flows.  Its graphic interface provides an immersive 3D interactive visualization of the complete system. GENIO’s architecture also enables new standard and customized features that support both evolving tool environments and proprietary customer-specific requirements.

Which one feature do you believe is absolutely key to the future of  Co-design ?
I believe that true system co-design must be created from concept to completion by including all components from board level to chip level within the same seamless, comprehensive environment.

GENIO allows designers to consider all system components from initial high level system design exploration to detailed system integration and optimization.  This is what enables design across multiple levels and components.

A larger competitor announced that they are working on a co-development tool, yet you’re announcing GENIO is available now.  How did you get to market so quickly?

We’re seeing larger EDA companies racing to address co-design by evolving and adapting existing IC and package design tools.  That approach severely compromises overall systems functionality.

At Monozukuri, we’ve been ahead of the game since 2014.  That’s why today, we’re delivering … and I emphasize delivering …  a ground-up, integrated technology that embraces all of  the demands of  complete 3D system co-design.

We’re able to do this because GENIO is completely unconstrained.  What I mean is that GENIO works with all system components from board to chip because we built it from the ground up. It’s completely agnostic to surrounding EDA tools and it interfaces with almost all IC and package physical design tools.

You keep emphasizing immediate availability. Where’s the data to back that up?
Over the past 12 month we’ve demonstrated GENIO to multiple customers and have run a number of custom optimizations.

For instances, we successfully completed a 2.5D system feasibility analysis in 6 hours that previously took three entire teams … one for architecture, one for backend and one for package … 15 days.  That’s literal a 99.95% reduction in design time, with an associated 99.95% cost savings.

Another customer used GENIO to determine in four hours what a manual solution couldn’t accomplish in two weeks:  Discovering that a proposed IC/packaging system architecture wouldn’t work.

Finally, GENIO optimized a 2.5D HBM-based design that included a complex hierarchical ASIC … multiple hard-IP, plus multiple soft IP, plus probe pads and a complex P&G pins scheme ..  using recursive methodology within 8 hours. While the customer didn’t disclose the cycle time, we believe their traditional methodology would have taken around 45 days.

What’s the roadmap for GENIO?  When can we expect to see a full 3D tool?
Today we have a 2D and 2.5D solutions available.  The 3D platform is in final stage beta testing and is scheduled for release in the 4th quarter.

GENIO 3D includes three features essential for complete system I/O optimization:  First, the ability to manage component placement priority within the 3D stack at the architectural exploration stage. Second, TSV location management to meet manufacturing and/or customer-specific constraints. And last, complete through-stack optimization to minimize TSV population whilst managing system optimization to lessen TSV yield impact .

This is a huge undertaking and you certainly haven’t been on the VC map.  Where did you get your funding?
We financed the company using European and Institutional private equity. Through this funding we were able to complete proof-of-concept and early product development.

However, the majority of funds has come from project grants associated with European research program. Through our participation in the Horizon 2020 program we not only made significant contributions to European research, but also used the findings to complete tool development and get ourselves ready to market.

Where to from here?  When can we expect to hear more from Monozukuri?
Actually, now that we’re negotiating initial licenses, you’ll probably see a great deal of us.  While we were in stealth, we felt it necessary to decline a number of invitations to discuss our technology platform and some of the co-design challenges we all face.  Now, we’re wide open to discussing what we see as the barriers and opportunities along the co-design frontier.  We already shared our short-term roadmap, and we look forward to upholding our role as co-design innovator.


For further information, please link to the full Interview