GENIOTM 1.7 Further Shortens Design

GENIOTM 1.7 brings new integrated design checks and issue tracking features that reduce design time spent on this onerous step by tracking and classifying, real time, potential design process issues.

GENIOTM 1.7
Further Shortens Design

Rome – December 22, 2022

New Integrated Design Checks & Issue Tracking

 Violations.  Perhaps the biggest Advanced IC/Packaging system design time sink.  They snarl the most elegant design.  They frustrate well-conceived time-to-market schedules.

MZ Technologies feels your pain.  Now, GENIOTM 1.7 brings relief with new integrated design checks and issue tracking features that reduce design time spent on this onerous step by tracking and classifying, real time, potential design process issues.

Using a dedicated always-on dock GENIOTM 1.7 alerts designers to a full list of problems classified by severity, scope, and category. This extensive check updates after any operation with new violations appearing in the “Issues Dock.”

Select an issue in the dedicated dock and all errors and warning are highlighted with a severity-driven colour across the GUI and the 2D/3D design views.

GENIOTM 1.7 performs several categories of checks.  Key among them are checks on placement rules during floor planning to catch violations such as overlapping instances, out of boundary placement, and ignored keep-out zones.  Other checks spot vertical routing connectivity issues, such as broken nets and crossing fly lines.

Don’t let violations boondoggle your time-to-design.

Click on this link to see how MZ Technologies GENIOTM 1.7 can reduce design time with its integrated design checks and issue tracking features.

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1-408-310-9244



For further information, please link to the source Press Release 



Moore’s Law Inevitable Decline Opens New Path to IC Innovation

“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli.

Moore’s Law Inevitable Decline Opens New Path to IC Innovation

Rome – December 15, 2022

The monolithic IC give way to multiple device packages  

“Moore’s Law” will inevitably come to a screeching halt, says Monozukuri CEO and Founder, Anna Fontanelli. Integrating chiplet, package and integrated circuit (IC) systems through a seamless IC/packaging co-design methodology re-opens the path to next gen IC innovation.

Ms. Fontanelli shared her prediction and resolution with semiconductor leaders recently at SemIsrael, addressing why a broad swath of the world’s population should pay attention to the growing importance of advanced packaging and 3D integration.

“With integrated circuits continuously shrinking and the continuous evolution of technological processes, Moore’s Law is entering a bottleneck,” Ms. Fontanelli pointed out. “At present, 3D integration technology is a new hope to solve this dilemma.”

Shrinking transistors below a 1-nanometer node gets closer to the technology’s limit.  To further scale IC-functionality means moving “off chip” to vertical IC integration. This, Ms. Fontanelli explains, is the most practical way – perhaps the only way – to increase design complexity, reduce time-to-market and lower per unit costs.  Certainly, it’s more economically viable than extreme miniaturization, she claims.

Key to this new direction is that stand-alone ICs … sensors, memories, microprocessors, and RF … can now be integrated into a single unit on configurable silicon substrates and advanced packaging technologies.

Stacking chips horizontally and vertically makes possible another step up in performance and expanding the Moore’s law.  However, the move from traditional planar design to 3D integration brings many challenges.

New EDA tools, methodologies and flows must be developed to automate IC, package and ultimately the entire electronic system design process, while at the same time reducing design time, and enabling greater integration.

Ms. Fontanelli then introduced Monozukuri’s GENIOTM.  GENIOTM was the first integrated IC/Packaging EDA tool on the market.  It facilitates the widespread use of 3D-ICs, enabling the design of complex heterogeneous configurations.  It’s advanced co-design environment integrates with traditional package and IC design tools through a standard format that streamlines the design flow.

GENIOTM features system architecture exploration, what-if analysis, 3D interconnect management, I/O planning and optimization, integrated within all existing EDA implementation platforms.  It’s optimization algorithms tame the computational complexity of 3D designs. It supports all system architectures (2D, 2.5D, 3D configurations), all assembly styles (wire-bonding, flip-chip, and mixed) and all design flows (die-driven, package-driven, a mixture of top-down & bottom-up).

ABOUT MONOZUKURI

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.


Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1-408-310-9244



For further information, please link to the source Press Release