Month: February 2021

GENIO IC/Package Co-Design EDA Tool First to Offer End-to-End Optimization

By AIT News Desk On Jan 12, 2021

MZ Technologies underscored several key IC/package co-design features that are critical to meeting today’s high-performance advanced technology IC device needs. The company’s GENIO IC/Package Co-Design EDA tool is the industry’s only end-toend optimized solution that covers all the requirements.

Visionary IC systems designers have identied seven key features that should be incorporated into the ideal integrated IC/package co-design tool. These include: IC, package PCB design environment support, system-level I/O planning and optimization, a holistic design environment, mixed silicon and photonics, interconnect optimization, open standards, and tool agnostic work fows.

GENIO is the only EDA tool that provides all seven, integrating silicon and package EDA flows to create a full co-design and end-to-end optimized design environment for complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.

“The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution.  Because we imagined and built the technology platform from the ground up, GENIO is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.

“The IC/Packaging co-design tool segment today is swiftly maturing, but none of the Big 3 have yet to offer an optimized end-to-end solution. Because we imagined and built the technology platform from the ground up, GENIO is architected from a ‘design first’ rather than a ‘proprietary technology first’ perspective,” explained Anna Fontanelli, Founder and CEO of MZ Technologies.

GENIO’s holistic design environment dramatically shortens design cycle time through unique features that include cross-hierarchical, 3D-aware, design methodologies that streamline the entire IC eco-system.  It has proven to be very application and packaging friendly, featuring quick IC, package, system constraints definition/import/export and a seamless interface with existing EDA environment and custom design flows.

The result is right-the-first-time concept-to-design methodology, thanks to strong “what-if” analysis and system level exploration across architectures.  GENIO identifies the most proficient solution and avoids entering “dead-end” architectures/design roads.  At the same time, it automates and optimize hundreds of thousands of connections, minimizing the number of physical resources needed for system interconnect.

GENIO also eliminates design environment boundaries to enable system architectural exploration that identifies errors and bottleneck early in the design process. It also features cross-hierarchical pathfinding for pin assignment optimization, wire lengths/crossovers reduction, and floor planning-aware silicon interposer design.

EE Times Europe mentions the GENIO™ EDA design tool as the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems.

EDA TOOL FOR HETEROGENEOUS SYSTEMS

On the tools and software front, a new EDA design tool is claimed to be the first commercially available platform enabling fully integrated, design environment-agnostic IC and packaging co-design of 2D/2.5D/3D heterogenous systems. The GENIO tool, from Rome-based startup Monozukuri Technologies, integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multichip designs that comprise advanced heterogeneous microelectronic systems. GENIO is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization, according to the company.

The cross-hierarchical, 3D-aware design methodologies streamline the IC ecosystem, integrating IC and advanced packaging design to ensure full system-level optimization, shortening the design cycles, accelerating time to manufacturing, and improving yields. The industry is moving to heterogeneous integration to overcome the limitations of Moore’s Law in enhancing performance. But the diverse nature of silicon and package technologies and the use of highspeed interconnections call for enhancements in co-design capabilities to enable planning, implementation, and analysis across different engineering domains as well as to provide a complete, consistent model across tool platforms.

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