August 2020 - MZ TECHNOLOGIES

Monozukuri Unveils GENIO, The First Commercially-Available IC / Package Co-Design Tool

MZ TECHNOLOGIES, rebrand of Monozukuri EDA, unveiled GENIO™, the first commercially available IC/Package Co-Design Tool.

GENIO™ Available Immediately.

Monozukuri Unveils First Commercially-Available IC / Package Co-Design Tool

GENIO^TM Available Immediately

Rome – Italy – August 25, 2020

Monozukuri S.p.A, today unveiled GENIO^TM, the first commercially available IC/Package Co-Design Tool. The company said that is able to take orders for GENIO^TM now.GENIO^TM is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.

GENIO^TM integrates existing silicon and package EDA flows to create full co-design and I/O optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems. It is the first tool to seamlessly work across all existing EDA flows to maximize design efficiency and system optimization.

“GENIO^TM is not a promise or partial solution. It is a breakthrough, ground-up tool that is ready for implementation today,” said Anna Fontanelli, Founder and CEO.

“GENIO^TM’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization”, she explained.

Equally important is the fact that GENIO is agnostic to all EDA flows. It is not a ‘bolt on’ capability like other co-design options, but a total re-conceptualizion and implementation that maximizes design efficiency across system level design.

GENIO^TM ’s complete cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system. It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.

The Duet^TM graphic user interface (GUI) creates an environment where cross-fabric structures can be imported, created, and stored in a common database. The system’s efficient automation allows designers to create, explore, optimize and compare different floor-planning, scenarios and dynamically modify and store optimization results according to the final configuration.

As an integrated IC and packaging co-design EDA tool, GENIO^TMsets a new benchmark for creating heterogeneous microelectronic systems-level design for advanced applications such as artificial intelligence, virtual reality and web scale infrastructure.

For a more information, go to www.monozukuri.eu

About Monozukuri

Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground breaking EDA software solutions and methodologies.
The GENIO^TMtechnology was developed under the H2020 HIPER project. HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact
Chuck Byers
charles.byers@monozukuri.eu
+1 408 310 9244

Business contact
Eric Gunn
eric.gunn@monozukuri.eu
+44 0783 4490803