MZ    TECHNOLOGIES
announces

The first commercially-available integrated IC/Packaging co-design EDA tool

GENIO™ - Global

The Foundation for Chiplet Design
Provides dynamic System views

GENIO™ - Efficient

Revolutionary fully Integrated end-to-end IC and Packaging Co-design

Enables design of 2D/2.5D/3D-IC systems

“What-if” system-level architectural exploration

GENIO™ - Neutral

Create Full 2D/2.5D/3D 2.5D Co-design and I/O Optimization

Interfaces to existing EDA environments and custom design flows

GENIO™ - Iterative

Shortens Design Cycles, Drives Faster Time-to-Manufacturing, Improve Yields

Functions across system design at macro and micro levels

GENIO™ - Optimal

3D-aware Cross-hierarchical pathfinding

Silicon Interposer, floor-planning aware, design and optimization