our technology

hanoi

I/O planning and optimization for ≥ 2D-IC integration

  • Heavily hierarchical, can support a virtually unlimited number/combination of levels of hierarchy
  • Can be applied at the package-, interposer- or die-level
  • The methodology supports both bottom-up (package-driven, balls assigned) and top-down (die-driven) flows, and hybrids
  • The GUI is QT-based
  • The command-line language is Tcl
  • OSs are Linux and Windows

Die level: I/O Planning & Optimization, RDL Feasibility

Silicon interposer level: TSV/C4 Planning & Optimization, Routing Feasibility

Package-Level: I/O Planning & Optimization

HIPER

Heterogeneous Integrated Platform for Electronic system Redistribution: a revolutionary I/O Planning Solution for 2.5D & 3D Nanoelectronic Systems Design

Monozukuri HIPER project has been submitted under the Horizon 2020's SME instrument phase 1, in the area of Open Disruptive Innovation Scheme (ODI). It received the Seal of Excellence from the European Commission in 2015 and it has been funded in June 2016. In 2017 it has been awarded again with the Seal of Excellence for phase 2 and in April 2018 the project has been selected for the final interview in Brussels.

Automated I/O Planning Optimization preview